Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP08A0320K0FEJ Vishay / Dale	RES ARRAY 4 RES 20K OHM 8SIP	227
MSP10A0147K0GEJ Vishay / Dale	RES ARRAY 9 RES 47K OHM 10SIP	0
CSC09B012K20GPA Vishay / Dale	RES ARRAY 8 RES 2.2K OHM 9SIP	0
MSP08A0322R0GEJ Vishay / Dale	RES ARRAY 4 RES 22 OHM 8SIP	0
MSP06A01510RGEJ Vishay / Dale	RES ARRAY 5 RES 510 OHM 6SIP	0
M8340107K1002FGD03 Vishay / Dale	RES ARRAY 3 RES 10K OHM 6SIP	0
SOMC160322K1FEA Vishay / Dale	RES ARRAY 8 RES 22.1K OHM 16SOIC	0
CRA04S0833K90JTD Vishay / Dale	RES ARRAY 4 RES 3.9K OHM 0804	402
MDP1405680AGE04 Vishay / Dale	RES NTWRK 24 RES MULT OHM 14DIP	0
CRA06S08315K0JTA Vishay / Dale	RES ARRAY 4 RES 15K OHM 1206	947
CSC10A0120K0GEK Vishay / Dale	RES ARRAY 9 RES 20K OHM 10SIP	0
MSP08A03470RGEJ Vishay / Dale	RES ARRAY 4 RES 470 OHM 8SIP	0
M8340109K1001GGD03 Vishay / Dale	RES ARRAY 5 RES 1K OHM 10SIP	0
CSC08A03300RGEK Vishay / Dale	RES ARRAY 4 RES 300 OHM 8SIP	0
MDP14032K00FE04 Vishay / Dale	RES ARRAY 7 RES 2K OHM 14DIP	0
MSP08C011K00GEJ Vishay / Dale	RES ARRAY 7 RES 1K OHM 8SIP	0
MSP08A012K20FEJ Vishay / Dale	RES ARRAY 7 RES 2.2K OHM 8SIP	0
CSC10A034K70GEK Vishay / Dale	RES ARRAY 5 RES 4.7K OHM 10SIP	0
MSP06C01330RGEJ Vishay / Dale	RES ARRAY 5 RES 330 OHM 6SIP	0
CSC07A0110K0GEK Vishay / Dale	RES ARRAY 6 RES 10K OHM 7SIP	704

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages