Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC06A03470KGPA Vishay / Dale	RES ARRAY 3 RES 470K OHM 6SIP	0
CRA12E083150KJTR Vishay / Dale	RES ARRAY 4 RES 150K OHM 2012	0
MDP14012K70GE04 Vishay / Dale	RES ARRAY 13 RES 2.7K OHM 14DIP	0
CRA06P083360RJTA Vishay / Dale	RES ARRAY 4 RES 360 OHM 1206	0
MDP140382R0GE04 Vishay / Dale	RES ARRAY 7 RES 82 OHM 14DIP	0
SOMC16031K00FEA Vishay / Dale	RES ARRAY 8 RES 1K OHM 16SOIC	0
CRA12E083220RJTR Vishay / Dale	RES ARRAY 4 RES 220 OHM 2012	0
CRA06S083150RJTA Vishay / Dale	RES ARRAY 4 RES 150 OHM 1206	4142
MDP160375R0GE04 Vishay / Dale	RES ARRAY 8 RES 75 OHM 16DIP	0
CRA06P083820KJTA Vishay / Dale	RES ARRAY 4 RES 820K OHM 1206	0
SOMC160330K1FEA Vishay / Dale	RES ARRAY 8 RES 30.1K OHM 16SOIC	0
CRA06P083510KJTA Vishay / Dale	RES ARRAY 4 RES 510K OHM 1206	0
CRA06S0831K60JTA Vishay / Dale	RES ARRAY 4 RES 1.6K OHM 1206	60
CRA12E08368K0JTR Vishay / Dale	RES ARRAY 4 RES 68K OHM 2012	0
MDP1403470RGE04 Vishay / Dale	RES ARRAY 7 RES 470 OHM 14DIP	0
CSC08A0320K0GEK Vishay / Dale	RES ARRAY 4 RES 20K OHM 8SIP	0
CSC10A011M00GPA Vishay / Dale	RES ARRAY 9 RES 1M OHM 10SIP	0
MSP08A0347R0GEJ Vishay / Dale	RES ARRAY 4 RES 47 OHM 8SIP	0
SOMC1401680RGEA Vishay / Dale	RES ARRAY 13 RES 680 OHM 14SOIC	0
CRA04S08375R0JTD Vishay / Dale	RES ARRAY 4 RES 75 OHM 0804	349

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages