Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA12E0831K00JTR Vishay / Dale	RES ARRAY 4 RES 1K OHM 2012	0
CSC08A036K80GPA Vishay / Dale	RES ARRAY 4 RES 6.8K OHM 8SIP	0
CSC08A01220RGPA Vishay / Dale	RES ARRAY 7 RES 220 OHM 8SIP	0
CSC09B0110K0GPA Vishay / Dale	RES ARRAY 8 RES 10K OHM 9SIP	0
CRA06P08362K0JTA Vishay / Dale	RES ARRAY 4 RES 62K OHM 1206	0
CSC10A03470RGPA Vishay / Dale	RES ARRAY 5 RES 470 OHM 10SIP	0
CSC08A034K70GEK Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 8SIP	20
CSC08A01100KGEK Vishay / Dale	RES ARRAY 7 RES 100K OHM 8SIP	0
CRA06S0839K10JTA Vishay / Dale	RES ARRAY 4 RES 9.1K OHM 1206	460
MSP10A031K00GEJ Vishay / Dale	RES ARRAY 5 RES 1K OHM 10SIP	0
CRA06P08391R0JTA Vishay / Dale	RES ARRAY 4 RES 91 OHM 1206	0
SOMC160356R0GEA Vishay / Dale	RES ARRAY 8 RES 56 OHM 16SOIC	0
CSC10A0310K0GPA Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	0
SOMC140391R0GEA Vishay / Dale	RES ARRAY 7 RES 91 OHM 14SOIC	0
CRA04P08322R0JTD Vishay / Dale	RES ARRAY 4 RES 22 OHM 0804	15908
M8340109K1001GCD03 Vishay / Dale	RES ARRAY 9 RES 1K OHM 10SIP	130
MSP10A01220KGEJ Vishay / Dale	RES ARRAY 9 RES 220K OHM 10SIP	0
CSC12B014K70GPA Vishay / Dale	RES ARRAY 11 RES 4.7K OHM 12SIP	0
CSC10A0127K0GPA Vishay / Dale	RES ARRAY 9 RES 27K OHM 10SIP	0
MSP10A011K20GEJ Vishay / Dale	RES ARRAY 9 RES 1.2K OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages