Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP06A01680RGEJ Vishay / Dale	RES ARRAY 5 RES 680 OHM 6SIP	0
CRA06P08316K0JTA Vishay / Dale	RES ARRAY 4 RES 16K OHM 1206	0
CSC06A013K90GPA Vishay / Dale	RES ARRAY 5 RES 3.9K OHM 6SIP	0
CSC10A0122K0GPA Vishay / Dale	RES ARRAY 9 RES 22K OHM 10SIP	0
MDP14014K70GE04 Vishay / Dale	RES ARRAY 13 RES 4.7K OHM 14DIP	0
CSC10A0310K0GEK Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	489
CSC10A011K00GEK Vishay / Dale	RES ARRAY 9 RES 1K OHM 10SIP	298
CSC10B0310K0FPA Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	0
CRA06E0834K70JTA Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 1206	6
MSP06A031M00GEJ Vishay / Dale	RES ARRAY 3 RES 1M OHM 6SIP	0
CSC05A01330RGPA Vishay / Dale	RES ARRAY 4 RES 330 OHM 5SIP	0
MDP16031K80GE04 Vishay / Dale	RES ARRAY 8 RES 1.8K OHM 16DIP	0
CSC04A0320K0GPA Vishay / Dale	RES ARRAY 2 RES 20K OHM 4SIP	0
CSC06A037K32FPA Vishay / Dale	RES ARRAY 3 RES 7.32K OHM 6SIP	0
CRA04S08327R0JTD Vishay / Dale	RES ARRAY 4 RES 27 OHM 0804	13
MSP09A0133R0GEJ Vishay / Dale	RES ARRAY 8 RES 33 OHM 9SIP	0
CRA06P083300RJTA Vishay / Dale	RES ARRAY 4 RES 300 OHM 1206	0
SOMC140110K0JEA Vishay / Dale	RES ARRAY 13 RES 10K OHM 14SOIC	0
MSP06A0110K0GEJ Vishay / Dale	RES ARRAY 5 RES 10K OHM 6SIP	0
MDP1403220RGE04 Vishay / Dale	RES ARRAY 7 RES 220 OHM 14DIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages