Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC10A0115K0GPA Vishay / Dale	RES ARRAY 9 RES 15K OHM 10SIP	0
MSP06C0310K0GEJ Vishay / Dale	RES ARRAY 3 RES 10K OHM 6SIP	0
MSP10C01180RGEJ Vishay / Dale	RES ARRAY 9 RES 180 OHM 10SIP	0
ACASN1001S1003P1AT Vishay / Dale	ACAS 0606 1K0 S 100K AT P1	2000
CSC09A01220KGEK Vishay / Dale	RES ARRAY 8 RES 220K OHM 9SIP	0
CSC06A0122K0GPA Vishay / Dale	RES ARRAY 5 RES 22K OHM 6SIP	0
CSC10A031K40FEK Vishay / Dale	RES ARRAY 5 RES 1.4K OHM 10SIP	0
SOMC1403100RGEA Vishay / Dale	RES ARRAY 7 RES 100 OHM 14SOIC	0
CSC10A0122K0GEK Vishay / Dale	RES ARRAY 9 RES 22K OHM 10SIP	0
MSP06A032K20GEJ Vishay / Dale	RES ARRAY 3 RES 2.2K OHM 6SIP	0
SOMC160327R0GEA Vishay / Dale	RES ARRAY 8 RES 27 OHM 16SOIC	0
CSC08A016K80GPA Vishay / Dale	RES ARRAY 7 RES 6.8K OHM 8SIP	0
SOMC16016K20JEA Vishay / Dale	RES ARRAY 15 RES 6.2K OHM 16SOIC	0
SOMC16031M00GEA Vishay / Dale	RES ARRAY 8 RES 1M OHM 16SOIC	0
MSP06C01100KGEJ Vishay / Dale	RES ARRAY 5 RES 100K OHM 6SIP	0
CRA06P08310R0JTA Vishay / Dale	RES ARRAY 4 RES 10 OHM 1206	4910
CRA06S0831K50JTA Vishay / Dale	RES ARRAY 4 RES 1.5K OHM 1206	168
CSC06A033K90GPA Vishay / Dale	RES ARRAY 3 RES 3.9K OHM 6SIP	0
CSC08A0375R0GEK Vishay / Dale	RES ARRAY 4 RES 75 OHM 8SIP	0
SOMC200310K0FEA Vishay / Dale	RES ARRAY 10 RES 10K OHM 20SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages