Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP10A0110K0GEJ Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	0
SOMC140151K0GEA Vishay / Dale	RES ARRAY 13 RES 51K OHM 14SOIC	0
CSC07A0147K0GEK Vishay / Dale	RES ARRAY 6 RES 47K OHM 7SIP	0
SOMC14012K20GEA Vishay / Dale	RES ARRAY 13 RES 2.2K OHM 14SOIC	0
CSC08A01330RGEK Vishay / Dale	RES ARRAY 7 RES 330 OHM 8SIP	2248
CSC06A0310K0GPA Vishay / Dale	RES ARRAY 3 RES 10K OHM 6SIP	0
SOMC1405191AGEA Vishay / Dale	RES NTWRK 24 RES MULT OHM 14SOIC	0
MSP06C01180RGEJ Vishay / Dale	RES ARRAY 5 RES 180 OHM 6SIP	0
SOMC160322K0JEA Vishay / Dale	RES ARRAY 8 RES 22K OHM 16SOIC	0
MDP1605191AGE04 Vishay / Dale	RES NTWRK 28 RES MULT OHM 16DIP	0
CRA04S083390RJTD Vishay / Dale	RES ARRAY 4 RES 390 OHM 0804	848
MDP14032K20GE04 Vishay / Dale	RES ARRAY 7 RES 2.2K OHM 14DIP	0
MSP10A01820RGEJ Vishay / Dale	RES ARRAY 9 RES 820 OHM 10SIP	0
CRA04S083150RJTD Vishay / Dale	RES ARRAY 4 RES 150 OHM 0804	1150
SOMC140320K0GEA Vishay / Dale	RES ARRAY 7 RES 20K OHM 14SOIC	0
MSP10C01100RGEJ Vishay / Dale	RES ARRAY 9 RES 100 OHM 10SIP	0
CSC09A0147K0GPA Vishay / Dale	RES ARRAY 8 RES 47K OHM 9SIP	0
CSC09A012K20GPA Vishay / Dale	RES ARRAY 8 RES 2.2K OHM 9SIP	0
SOMC14033K30GEA Vishay / Dale	RES ARRAY 7 RES 3.3K OHM 14SOIC	0
MSP06A03820RGEJ Vishay / Dale	RES ARRAY 3 RES 820 OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages