Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA06P0834K70JTA Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 1206	6
SOMC160322R0GEA Vishay / Dale	RES ARRAY 8 RES 22 OHM 16SOIC	2007
MSP08A0315K0GEJ Vishay / Dale	RES ARRAY 4 RES 15K OHM 8SIP	0
CSC08A031K20GEK Vishay / Dale	RES ARRAY 4 RES 1.2K OHM 8SIP	0
CSC08A0110K0GEK Vishay / Dale	RES ARRAY 7 RES 10K OHM 8SIP	1652
MDP16031K00GE04 Vishay / Dale	RES ARRAY 8 RES 1K OHM 16DIP	210
MSP08A03270RGEJ Vishay / Dale	RES ARRAY 4 RES 270 OHM 8SIP	0
MSP10A0310K0FEJ Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	0
SOMC140133K0GEA Vishay / Dale	RES ARRAY 13 RES 33K OHM 14SOIC	0
CSC08A031K00GPA Vishay / Dale	RES ARRAY 4 RES 1K OHM 8SIP	0
CRA12E083330KJTR Vishay / Dale	RES ARRAY 4 RES 330K OHM 2012	0
MSP10A014K70FEJ Vishay / Dale	RES ARRAY 9 RES 4.7K OHM 10SIP	0
MDP1603470RGE04 Vishay / Dale	RES ARRAY 8 RES 470 OHM 16DIP	0
MDP1603110RGE04 Vishay / Dale	RES ARRAY 8 RES 110 OHM 16DIP	0
CSC08A01330RGPA Vishay / Dale	RES ARRAY 7 RES 330 OHM 8SIP	0
SOMC1403150RGEA Vishay / Dale	RES ARRAY 7 RES 150 OHM 14SOIC	0
MSP08A0122K0GEJ Vishay / Dale	RES ARRAY 7 RES 22K OHM 8SIP	0
MSP10A03470KFEJ Vishay / Dale	RES ARRAY 5 RES 470K OHM 10SIP	0
SOMC16031K80GEA Vishay / Dale	RES ARRAY 8 RES 1.8K OHM 16SOIC	0
CSC08A0368R0GPA Vishay / Dale	RES ARRAY 4 RES 68 OHM 8SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages