Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP08C031M00GEJ Vishay / Dale	RES ARRAY 4 RES 1M OHM 8SIP	0
SOMC160310K0GEA Vishay / Dale	RES ARRAY 8 RES 10K OHM 16SOIC	331
MDP1403200RGE04 Vishay / Dale	RES ARRAY 7 RES 200 OHM 14DIP	0
CSC12B01120RGPA Vishay / Dale	RES ARRAY 11 RES 120 OHM 12SIP	0
CSC06A0133R0GPA Vishay / Dale	RES ARRAY 5 RES 33 OHM 6SIP	0
SOMC1603150RGEA Vishay / Dale	RES ARRAY 8 RES 150 OHM 16SOIC	0
CRA06P083560KJTA Vishay / Dale	RES ARRAY 4 RES 560K OHM 1206	0
CSC10B012K20GPA Vishay / Dale	RES ARRAY 9 RES 2.2K OHM 10SIP	0
CSC09A0110K0GPA Vishay / Dale	RES ARRAY 8 RES 10K OHM 9SIP	0
CSC09A014K70GEK Vishay / Dale	RES ARRAY 8 RES 4.7K OHM 9SIP	8859
CSC06A03220RGPA Vishay / Dale	RES ARRAY 3 RES 220 OHM 6SIP	0
CSC06A014K70GEK Vishay / Dale	RES ARRAY 5 RES 4.7K OHM 6SIP	0
CSC10A05121CGEK Vishay / Dale	RES NTWRK 16 RES MULT OHM 10SIP	0
CSC10A031K00GPA Vishay / Dale	RES ARRAY 5 RES 1K OHM 10SIP	0
SOMC14031K00GEA Vishay / Dale	RES ARRAY 7 RES 1K OHM 14SOIC	0
CRA06S083330KJTA Vishay / Dale	RES ARRAY 4 RES 330K OHM 1206	4787
CSC08A03330RGEK Vishay / Dale	RES ARRAY 4 RES 330 OHM 8SIP	816
CSC11B0110K0FPA Vishay / Dale	RES ARRAY 10 RES 10K OHM 11SIP	0
MSP08A0333R0GEJ Vishay / Dale	RES ARRAY 4 RES 33 OHM 8SIP	0
CRA06P083110KJTA Vishay / Dale	RES ARRAY 4 RES 110K OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages