Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP08A0310K0FEJ Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	0
MSP08A03100KFEJ Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
CSC08A03220RGPA Vishay / Dale	RES ARRAY 4 RES 220 OHM 8SIP	0
CSC06A0147K0GPA Vishay / Dale	RES ARRAY 5 RES 47K OHM 6SIP	0
MDP14031K80GE04 Vishay / Dale	RES ARRAY 7 RES 1.8K OHM 14DIP	0
SOMC160312K0GEA Vishay / Dale	RES ARRAY 8 RES 12K OHM 16SOIC	1198
CRA04S08312R0JTD Vishay / Dale	RES ARRAY 4 RES 12 OHM 0804	665
CSC06A01510RGEK Vishay / Dale	RES ARRAY 5 RES 510 OHM 6SIP	0
CRA06S08322R1FTA Vishay / Dale	RES ARRAY 4 RES 22.1 OHM 1206	15
CSC09A01330RGPA Vishay / Dale	RES ARRAY 8 RES 330 OHM 9SIP	0
SOMC160336R0GEA Vishay / Dale	RES ARRAY 8 RES 36 OHM 16SOIC	0
CRA04S08368R0JTD Vishay / Dale	RES ARRAY 4 RES 68 OHM 0804	9405
MSP06C034K70GEJ Vishay / Dale	RES ARRAY 3 RES 4.7K OHM 6SIP	0
CSC09A011K00FPA Vishay / Dale	RES ARRAY 8 RES 1K OHM 9SIP	0
SOMC160339K2FEA Vishay / Dale	RES ARRAY 8 RES 39.2K OHM 16SOIC	0
CRA06S083270RJTA Vishay / Dale	RES ARRAY 4 RES 270 OHM 1206	15
MDP1603390RGE04 Vishay / Dale	RES ARRAY 8 RES 390 OHM 16DIP	0
CRA06S08320K0JTA Vishay / Dale	RES ARRAY 4 RES 20K OHM 1206	96
CRA12E083680RJTR Vishay / Dale	RES ARRAY 4 RES 680 OHM 2012	10
SOMC160324K3FEA Vishay / Dale	RES ARRAY 8 RES 24.3K OHM 16SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages