Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MSP08A032K20GEJ Vishay / Dale	RES ARRAY 4 RES 2.2K OHM 8SIP	0
SOMC16011M00FEA Vishay / Dale	RES ARRAY 15 RES 1M OHM 16SOIC	0
CSC09A015K60GPA Vishay / Dale	RES ARRAY 8 RES 5.6K OHM 9SIP	0
MDP1403820RGE04 Vishay / Dale	RES ARRAY 7 RES 820 OHM 14DIP	0
M8340107K1002GCD03 Vishay / Dale	RES ARRAY 5 RES 10K OHM 6SIP	0
CSC06A03470RGPA Vishay / Dale	RES ARRAY 3 RES 470 OHM 6SIP	0
SOMC1603470RGEA Vishay / Dale	RES ARRAY 8 RES 470 OHM 16SOIC	710
CSC09A0133K0GEK Vishay / Dale	RES ARRAY 8 RES 33K OHM 9SIP	0
SOMC16032K00GEA Vishay / Dale	RES ARRAY 8 RES 2K OHM 16SOIC	1510
MSP06A01100KGEJ Vishay / Dale	RES ARRAY 5 RES 100K OHM 6SIP	0
CSC09A01150RGPA Vishay / Dale	RES ARRAY 8 RES 150 OHM 9SIP	0
CSC08A03100KGPA Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
MSP08A031K50FEJ Vishay / Dale	RES ARRAY 4 RES 1.5K OHM 8SIP	0
MSP10C0310K0GEJ Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	0
MSP08A0133K0FEJ Vishay / Dale	RES ARRAY 7 RES 33K OHM 8SIP	0
CSC10A016K80GPA Vishay / Dale	RES ARRAY 9 RES 6.8K OHM 10SIP	0
CSC06A01100KGEK Vishay / Dale	RES ARRAY 5 RES 100K OHM 6SIP	0
SOMC2003100KGEA Vishay / Dale	RES ARRAY 10 RES 100K OHM 20SOIC	2003
MDP1401270RGE04 Vishay / Dale	RES ARRAY 13 RES 270 OHM 14DIP	0
CSC10A01220RGPA Vishay / Dale	RES ARRAY 9 RES 220 OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages