Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MDP140333R0GE04 Vishay / Dale	RES ARRAY 7 RES 33 OHM 14DIP	0
CSC08A0315K0GPA Vishay / Dale	RES ARRAY 4 RES 15K OHM 8SIP	0
CSC09A01560RGPA Vishay / Dale	RES ARRAY 8 RES 560 OHM 9SIP	0
MSP10C05221BGEJ Vishay / Dale	RES NTWRK 16 RES MULT OHM 10SIP	0
CSC08A0110K0GPA Vishay / Dale	RES ARRAY 7 RES 10K OHM 8SIP	0
CRA12E0831M00JTR Vishay / Dale	RES ARRAY 4 RES 1M OHM 2012	0
CRA06P083750RJTA Vishay / Dale	RES ARRAY 4 RES 750 OHM 1206	0
SOMC1603330RGEA Vishay / Dale	RES ARRAY 8 RES 330 OHM 16SOIC	318
CSC05A01100KGEK Vishay / Dale	RES ARRAY 4 RES 100K OHM 5SIP	1659
CSC10A032K00GPA Vishay / Dale	RES ARRAY 5 RES 2K OHM 10SIP	0
MSP06A0347K0GEJ Vishay / Dale	RES ARRAY 3 RES 47K OHM 6SIP	0
CSC08A03150KGPA Vishay / Dale	RES ARRAY 4 RES 150K OHM 8SIP	0
CSC08A033K30GEK Vishay / Dale	RES ARRAY 4 RES 3.3K OHM 8SIP	1650
SOMC160320K0FEA Vishay / Dale	RES ARRAY 8 RES 20K OHM 16SOIC	0
MDP1603330RGE04 Vishay / Dale	RES ARRAY 8 RES 330 OHM 16DIP	0
MDP16033K30GE04 Vishay / Dale	RES ARRAY 8 RES 3.3K OHM 16DIP	0
CSC06A0322R0GPA Vishay / Dale	RES ARRAY 3 RES 22 OHM 6SIP	0
MDP1603560RGE04 Vishay / Dale	RES ARRAY 8 RES 560 OHM 16DIP	0
CRA06S08324R0JTA Vishay / Dale	RES ARRAY 4 RES 24 OHM 1206	10000
CSC06A05750BGPA Vishay / Dale	RES NETWORK 8 RES MULT OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages