Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MDP140133K0GE04 Vishay / Dale	RES ARRAY 13 RES 33K OHM 14DIP	0
MDP1603200RGE04 Vishay / Dale	RES ARRAY 8 RES 200 OHM 16DIP	45
CSC08A031K80GPA Vishay / Dale	RES ARRAY 4 RES 1.8K OHM 8SIP	0
CSC08A03820RGEK Vishay / Dale	RES ARRAY 4 RES 820 OHM 8SIP	0
CSC04A0133K0GPA Vishay / Dale	RES ARRAY 3 RES 33K OHM 4SIP	0
CSC09A012K20GEK Vishay / Dale	RES ARRAY 8 RES 2.2K OHM 9SIP	1949
MDP1403100RGE04 Vishay / Dale	RES ARRAY 7 RES 100 OHM 14DIP	0
MSP10A012K20GEJ Vishay / Dale	RES ARRAY 9 RES 2.2K OHM 10SIP	0
MSP10C012K20GEJ Vishay / Dale	RES ARRAY 9 RES 2.2K OHM 10SIP	0
CSC09A0115K0GPA Vishay / Dale	RES ARRAY 8 RES 15K OHM 9SIP	0
MDP16011K80GE04 Vishay / Dale	RES ARRAY 15 RES 1.8K OHM 16DIP	0
CSC04A031M00GPA Vishay / Dale	RES ARRAY 2 RES 1M OHM 4SIP	0
CRA06S08347R0FTA Vishay / Dale	RES ARRAY 4 RES 47 OHM 1206	8
MSP10C011K20GEJ Vishay / Dale	RES ARRAY 9 RES 1.2K OHM 10SIP	0
M8340109K1002GGD03 Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	117
MDP14033K90GE04 Vishay / Dale	RES ARRAY 7 RES 3.9K OHM 14DIP	0
CSC06A01220KGPA Vishay / Dale	RES ARRAY 5 RES 220K OHM 6SIP	0
CRA06P08324K0JTA Vishay / Dale	RES ARRAY 4 RES 24K OHM 1206	0
SOMC1603220RJEA Vishay / Dale	RES ARRAY 8 RES 220 OHM 16SOIC	0
CSC06A01330RGPA Vishay / Dale	RES ARRAY 5 RES 330 OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages