Specialized ICs

Part Number	Description / PDF	Quantity
FS450R12OE4B61BOSA1 IR (Infineon Technologies)	FS450R12OE4 - INSULATED GATE BIP	3
BSM200GB120DN2S7HOSA1 IR (Infineon Technologies)	INSULATED GATE BIPOLAR TRANSISTO	31
PBM99024/11STA IR (Infineon Technologies)	INFINEON PBM99024/11ST - SOT23-6	35000
TLE4250GHUSA1 IR (Infineon Technologies)	POWER SUPPLY SUPPORT CIRCUIT, AD	0
KP214N2611 IR (Infineon Technologies)	KP214 - XENSIV ABSOLUTE PRESSURE	283769
PTVA127002EVV1R0XTMA1 IR (Infineon Technologies)	PTVA127002E - 700W L-BAND TRANSI	0
BSM150GB170DN2E3256HDLA1 IR (Infineon Technologies)	BSM150GB170DN2 - INSULATED GATE	128
SAH-XC2286M104F66LABHXUMA1 IR (Infineon Technologies)	16-BIT C166 MICROCONTROLLER - XC	1000
IPW65R190C7 IR (Infineon Technologies)	IPW65R190 - 650V AND 700V COOLMO	0
6ED003L06FXUMA1 IR (Infineon Technologies)	6ED003L06 - HALF-BRIDGE BASED MO	26000
DD900S17K6CB2NOSA1 IR (Infineon Technologies)	DD900S17K6 - POWER MODULE, DUAL	0
FS225R12KE3S1BDSA1 IR (Infineon Technologies)	CUSTOMER SPECIAL	0
XMC4400F100K256BAXQMA1 IR (Infineon Technologies)	XMC4400 - 32-BIT INDUSTRIAL MIC	0
TLE7295G IR (Infineon Technologies)	INFINEON TLE7295G	0
KP236N6165 IR (Infineon Technologies)	ANALOG ABSOLUTE PRESSURE SENSOR	0
BGS1711MC222IE6433XUSA1 IR (Infineon Technologies)	BGS1711MC22 - RF SWITCH	144000
BSM100GB120DN2S7HOSA1 IR (Infineon Technologies)	INSULATED GATE BIPOLAR TRANSISTO	30
RPN7720PLXTMA1 IR (Infineon Technologies)	RPN7720PL - DUAL-POWER AMPLIFIER	110
SAF-XE160FU8F66RAAFXUMA1 IR (Infineon Technologies)	XE160 - 16-BIT FLASH RISC MICROC	10000
TLE92682QXXUMA1 IR (Infineon Technologies)	INFINEON TLE9268 - VQFN-48-31	1014

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs