Specialized ICs

Part Number	Description / PDF	Quantity
ADM8668TXA12-G IR (Infineon Technologies)	WIRELESS NETWORK BRIDGING SYSTEM	5040
S007GGEG600997 IR (Infineon Technologies)	S007GGEG600997	0
SAB-C167C2-LMCA IR (Infineon Technologies)	SAB-C167CS-LM CA+ - LEGACY 16-BI	400
SAK-C161CS-LFCA IR (Infineon Technologies)	LEGACY 16-BIT MICROCONTROLLER	0
CG6865AS IR (Infineon Technologies)	CAPSENSE	0
SP311V90M106DHTMA1 IR (Infineon Technologies)	SP311V90M106DHTMA1	0
IPN50R3K0CE IR (Infineon Technologies)	SMALL SIGNAL FIELD-EFFECT TRANSI	0
FZ1800R17KF4NOSA1 IR (Infineon Technologies)	FZ1800R17 - INSULATED GATE BIPOL	84
6ED003L06-FXUMA1 IR (Infineon Technologies)	6ED003L06 - HALF-BRIDGE BASED MO	0
KP216H1416 IR (Infineon Technologies)	KP216 - XENSIV ABSOLUTE PRESSURE	13070
BSC0588NSIATMA1 IR (Infineon Technologies)	BSC0588- N-CHANNEL POWER MOSFET	215000
TLE4925CHAMA2 IR (Infineon Technologies)	DYNAMIC DIFFERENTIAL HALL EFFECT	36000
IRAMS10UP60C-2 IR (Infineon Technologies)	IRAMS10 - INTELLIGENT POWER MODU	480
TLE4986CBXTNF27NXTMA1 IR (Infineon Technologies)	TLE4986C - PROGRAMMABLE TRUE POW	6528
TLE82642EXUMA2 IR (Infineon Technologies)	TLE8264 - UNIVERSAL SYSTEM BASIS	129000
TLE4941CE6735BTMA1 IR (Infineon Technologies)	HALL EFFECT SENSOR	1998
SLS10EREUSON3XTMB5 IR (Infineon Technologies)	AUTHENTICATION	0
DF400R12KE3 IR (Infineon Technologies)	DFXR12H - IGBT MODULE	4
SAK-TC1797512F180EFXACKXUMA1 IR (Infineon Technologies)	RISC FLASH MICROCONTROLLER, 32-B	500
XC2361B40F80LRABHXUMA1 IR (Infineon Technologies)	16-BIT C166 MICROCONTROLLER - XC	1000

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs