Specialized ICs

Part Number	Description / PDF	Quantity
DD750S65K3NOSA2 IR (Infineon Technologies)	DD750S65K3 - 6500V, 750A, DIODES	2
IRFHS8342TRPBFTR IR (Infineon Technologies)	IRFHS8342 - 20V-100V N-CHANNEL S	4000
ESD5V0S2U-06E6327HTSA1 IR (Infineon Technologies)	ESD5V0 - SURGE PROTECTION DEVICE	12000
IPN65R1K5CE IR (Infineon Technologies)	SMALL SIGNAL FIELD-EFFECT TRANSI	0
BS0200N03S IR (Infineon Technologies)	BSO200 - 20V-250V P-CHANNEL POWE	0
FF450R12ME4B61BPSA1 IR (Infineon Technologies)	FF450R12ME4 - INSULATED GATE BIP	2
FD200R12KE3S1HOSA1 IR (Infineon Technologies)	FD200R12KE3 - IGBT MODULE	30
SAK-XC2060M104F80LAAKXUMA1 IR (Infineon Technologies)	LEGACY 16-BIT XC2000 MICROCONTRO	2000
XMC4500F144K1024ABXQMA1 IR (Infineon Technologies)	32-BIT INDUSTRIAL MICROCONTROLLE	0
IRFH8202TRPBFTR IR (Infineon Technologies)	IRFH8202 - 12V-300V N-CHANNEL PO	4000
FZ1800R16KF4NOSA1 IR (Infineon Technologies)	FZ1800R16 - IGBT MODULE	0
2PS1200R12KS4-4G-V IR (Infineon Technologies)	STACKED POWER MODULE	0
SAKXC2268N40F80LABKXUMA1 IR (Infineon Technologies)	16-BIT C166 MICROCONTROLLER - XC	3000
BTS50101EKAXUMA1 IR (Infineon Technologies)	AUTOMOTIVE SMART HIGH SIDE SWITC	630
PEF22624EV1.3-G IR (Infineon Technologies)	PEF22624 - SDFE-2 SYMMETRIC DSL	0
FZ1200R16KF4S1NOSA1 IR (Infineon Technologies)	FZ1200R16 - INSULATED GATE BIPOL	1
TLE8880TN IR (Infineon Technologies)	TLE8880 - ALTERNATOR REGULATOR	0
PX7510EDSGCS10060XUMA1 IR (Infineon Technologies)	PX7510EDSG - PRIMERION PMBUS COM	2000
SAF-XC2268M72F66LAAFXUMA1 IR (Infineon Technologies)	16-BIT C166 MICROCONTROLLER - XC	15400
TLF50281ELXUMA2 IR (Infineon Technologies)	TLF50281 - SWITCHING REGULATOR,	4556

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs