Specialized ICs

Part Number	Description / PDF	Quantity
SAH-XC2361A72F100LAAHXUMA1 IR (Infineon Technologies)	16-BIT C166 MICROCONTROLLER - XC	921
IPN70R1K5CE IR (Infineon Technologies)	SMALL SIGNAL FIELD-EFFECT TRANSI	0
BGS312MC272IE6433XUSA1 IR (Infineon Technologies)	BGS312MC27 - LIMITED DATA AVAILA	0
KP216K1409 IR (Infineon Technologies)	KP216 - XENSIV ABSOLUTE PRESSURE	23842
PBM99013/1EGBR1B IR (Infineon Technologies)	INFINEON PBM9901/31EGB - HBGA-50	2389
64-2084PBF IR (Infineon Technologies)	IRF2907ZSPBF - HEXFET N-CHANNEL	0
BGS1711MC222EE6433XUSA1 IR (Infineon Technologies)	BGS1711MC22 - RF SWITCH	240000
IPN70R750P7S IR (Infineon Technologies)	IPN70R750 - 650V AND 700V COOLMO	0
IPW60R031CFD7 IR (Infineon Technologies)	600V COOLMOS N-CHANNEL POWER MOS	0
IKZ50N65NH5XKSA IR (Infineon Technologies)	IKZ50N65 - DISCRETE IGBT WITH AN	36
IRF3710PBF 101D324.1 750 IR (Infineon Technologies)	IRF3710 - 100V N-CHANNEL POWER M	0
FF1000R17IE4S2BOSA1 IR (Infineon Technologies)	FF1000R17 - IGBT MODULE	87
SS07N70AKMA1046 IR (Infineon Technologies)	SS07N70 - 650V AND 700V COOLMOS	7500
SLE-6636COM-M3.2 IR (Infineon Technologies)	HIGH SECURITY AUTHENTICATION	254351
CWM60FN IR (Infineon Technologies)	CWM60FN - RECTIFIER DIODE	0
TLE4986CBXTNF27XTMA1 IR (Infineon Technologies)	TLE4986C - PROGRAMMABLE TRUE POW	301
SLB9660TT12FW443XUMA2 IR (Infineon Technologies)	SLB9660 - OPTIGA EMBEDDED SECURI	0
IPP80R600P7 IR (Infineon Technologies)	IPP80R600 - 800V COOLMOS N-CHANN	0
SAK-TC1367A264F150EFAAKXUMA1 IR (Infineon Technologies)	RISC FLASH MICROCONTROLLER, 32-B	900
9670VQ12FW640GOOGXUMA1 IR (Infineon Technologies)	SECURITY IC/AUTHENTICATION IC	0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs