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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
IPP60R280P6

IPP60R280P6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
IPP60R180P7

IPP60R180P7

IR (Infineon Technologies)

IPP60R180 - 600V COOLMOS N-CHANN

182
CG7680AA

CG7680AA

IR (Infineon Technologies)

USB HIGH SPEED HUBS

18
TLE6716GRXUMA1

TLE6716GRXUMA1

IR (Infineon Technologies)

TLE6716 - LIMITED DATA AVAILABLE

55000
6ED003L06F2XUMA2

6ED003L06F2XUMA2

IR (Infineon Technologies)

6ED003L06 - GATE DRIVER

1034
IPP50R190CE

IPP50R190CE

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 5

0
IPP60R360P7

IPP60R360P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

0
TLV4946K

TLV4946K

IR (Infineon Technologies)

TLV4946 - HALL SWITCH

12000
TX983HTMA1

TX983HTMA1

IR (Infineon Technologies)

TX98-3 - ASK TRANSMITTER

155000
1IRF3710PBF

1IRF3710PBF

IR (Infineon Technologies)

IRF3710 - 100V HEXFET N-CHANNEL

0
IPA60R280P6

IPA60R280P6

IR (Infineon Technologies)

600V, N-CHANNEL POWER MOSFET

0
SAK-XC886CLM8FFA5VACKXUMA1

SAK-XC886CLM8FFA5VACKXUMA1

IR (Infineon Technologies)

XC800 I-FAMILY MICROCONTROLLER ,

0
IPD80R1K4P7

IPD80R1K4P7

IR (Infineon Technologies)

800V, 1.4OHM, N-CHANNEL MOSFET,

464
BCR135TE6327

BCR135TE6327

IR (Infineon Technologies)

BIPOLAR DIGITAL TRANSISTOR

0
SLB9670VQ12FW643XUMA2

SLB9670VQ12FW643XUMA2

IR (Infineon Technologies)

SLB9670 - OPTIGA EMBEDDED SECURI

9224
IPN50R950CE

IPN50R950CE

IR (Infineon Technologies)

COOLMOS N-CHANNEL POWER MOSFET

780
SP001434884

SP001434884

IR (Infineon Technologies)

IPN60R1K0CEATMA1 - MOSFET

0
TLE4928CXAAF47XAMA1

TLE4928CXAAF47XAMA1

IR (Infineon Technologies)

TLE4928C - DYNAMIC DIFFERENTIAL

15000
PEB20560V3.1

PEB20560V3.1

IR (Infineon Technologies)

PEB20560 - TIME SLOT ASSIGNER

0
2EDN7223FXTMA1

2EDN7223FXTMA1

IR (Infineon Technologies)

POWER SWITCH, TRANSMITTER, REC

22500

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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