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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
SP000850810

SP000850810

IR (Infineon Technologies)

IPP50R280CEXKSA1 - 500V COOLMOS

0
IPW60R190E6

IPW60R190E6

IR (Infineon Technologies)

600V, 0.19OHM, N-CHANNEL MOSFET,

0
CP7417AT

CP7417AT

IR (Infineon Technologies)

PSOC1

82
IPW60R099P7

IPW60R099P7

IR (Infineon Technologies)

600V, 0.099OHM, N-CHANNEL MOSFET

0
IHW20N65R5

IHW20N65R5

IR (Infineon Technologies)

INSULATED GATE BIPOLAR TRANSISTO

0
IPW60R099CPA

IPW60R099CPA

IR (Infineon Technologies)

IPW60R099 - 600V-800V N-CHANNEL

240
BC817-25B5000

BC817-25B5000

IR (Infineon Technologies)

BIPOLAR GENERAL PURPOSE TRANSIST

15000
IPA65R280C6

IPA65R280C6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

0
IPI60R125CP

IPI60R125CP

IR (Infineon Technologies)

25A, 600V, 0.125OHM, N-CHANNEL M

0
TLE94713ESXUMA1

TLE94713ESXUMA1

IR (Infineon Technologies)

TLE9471 - SYSTEM BASIS CHIPS (SB

5000
CG7762AA

CG7762AA

IR (Infineon Technologies)

MICROPOWER SRAMS

0
IPI45N06S4-09AKSA2

IPI45N06S4-09AKSA2

IR (Infineon Technologies)

IPI45N06 - 55V-60V N-CHANNEL AUT

97500
IGP01N120H2XKSA1036

IGP01N120H2XKSA1036

IR (Infineon Technologies)

IGP01N120 - DISCRETE IGBT WITHOU

500
SP000687556

SP000687556

IR (Infineon Technologies)

IPP60R099C6XKSA1 - COOLMOS N-CHA

0
IPP50R380CE

IPP50R380CE

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 5

0
XC2387C200F100LABKXUMA1

XC2387C200F100LABKXUMA1

IR (Infineon Technologies)

16-BIT C166 MICROCONTROLLER - XC

0
IPP60R125C6

IPP60R125C6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 3

0
SP001385054

SP001385054

IR (Infineon Technologies)

IPP60R120C7XKSA1 - 600V COOLMOS

0
1EDN7550B

1EDN7550B

IR (Infineon Technologies)

1EDN7550 - GATE DRIVER

0
IPW60R330P6

IPW60R330P6

IR (Infineon Technologies)

IPW60R330 - 600V COOLMOS N-CHANN

8073

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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