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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
TLE94613ESXUMA1

TLE94613ESXUMA1

IR (Infineon Technologies)

IC TXRX CAN LITE SBC 2MBPS

2785
TLE9461ESV33XUMA1

TLE9461ESV33XUMA1

IR (Infineon Technologies)

TLE9461 - SYSTEM BASIS CHIPS (SB

5700
TLV4906L

TLV4906L

IR (Infineon Technologies)

TLV4906 - HALL SWITCH

2000
IPA60R380P6

IPA60R380P6

IR (Infineon Technologies)

600V COOLMOS POWER TRANSISTOR

0
PXB4221EV3.2

PXB4221EV3.2

IR (Infineon Technologies)

IWE8 INTERWORKING ELEMENT

0
IKW15N120H3

IKW15N120H3

IR (Infineon Technologies)

IKW15N120 - DISCRETE IGBT WITH A

120
TLE9832QXXUMA4

TLE9832QXXUMA4

IR (Infineon Technologies)

TLE9832 - MICROCONTROLLER WITH L

7500
PEB2026T-SV1.1

PEB2026T-SV1.1

IR (Infineon Technologies)

ISDN POWER CONTROLLER

9740
IPD80R900P7

IPD80R900P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

1832
SP001690382

SP001690382

IR (Infineon Technologies)

1EDN7550 - GATE DRIVER

0
IPW65R045C7

IPW65R045C7

IR (Infineon Technologies)

46A, 650V, 0.045OHM, N-CHANNEL M

0
IPA60R180C7

IPA60R180C7

IR (Infineon Technologies)

9A, 600V, 0.18OHM, N-CHANNEL MOS

0
BAR63-06E6327HTSA1

BAR63-06E6327HTSA1

IR (Infineon Technologies)

BAR63 - PIN DIODE

36000
PEB2026TSV1.1

PEB2026TSV1.1

IR (Infineon Technologies)

ISDN POWER CONTROLLER

602
IPP60R600P6

IPP60R600P6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

0
SP000797380

SP000797380

IR (Infineon Technologies)

IPA60R190E6XKSA1 - POWER FIELD-E

0
BSC014N04LST

BSC014N04LST

IR (Infineon Technologies)

BSC014N04 - 12V-300V N-CHANNEL P

0
TLE8264EXUMA1

TLE8264EXUMA1

IR (Infineon Technologies)

TLE8264 - UNIVERSAL SYSTEM BASIS

690
IPA60R080P7

IPA60R080P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
IPA60R280CFDD7

IPA60R280CFDD7

IR (Infineon Technologies)

IPA60R280 - 600V COOLMOS N-CHANN

500

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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