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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
TCA355G

TCA355G

IR (Infineon Technologies)

TCA355G - PROXIMITY SWITCH

0
IPP60R099P7

IPP60R099P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

233
IPA60R600P7

IPA60R600P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

0
TLV4946-2K

TLV4946-2K

IR (Infineon Technologies)

TLV4946 - HALL SWITCH

41346
BCR133E6393

BCR133E6393

IR (Infineon Technologies)

SMALL SIGNAL BIPOLAR TRANSISTOR

111000
BCR116E6393

BCR116E6393

IR (Infineon Technologies)

SMALL SIGNAL BIPOLAR TRANSISTOR

0
TLE9104SHXUMA1

TLE9104SHXUMA1

IR (Infineon Technologies)

IC POWERTRAIN SWITCH DSO20-88

0
PEB2025NV1.5

PEB2025NV1.5

IR (Infineon Technologies)

ISDN EXCHANGE POWER CONTROLLER

40
SAK-XC2786X96F66LACKXUMA1

SAK-XC2786X96F66LACKXUMA1

IR (Infineon Technologies)

16-BIT C166 MICROCONTROLLER - XC

0
IHW20N120R5

IHW20N120R5

IR (Infineon Technologies)

IHW20N120 - DISCRETE IGBT WITH A

240
IPP65R380E6

IPP65R380E6

IR (Infineon Technologies)

IPP65R380E6 - 650V-700V COOLMOS

0
IPW60R070P6

IPW60R070P6

IR (Infineon Technologies)

600V, 0.07OHM, N-CHANNEL MOSFET,

0
SLS32AIA020A4USON10XTMA2

SLS32AIA020A4USON10XTMA2

IR (Infineon Technologies)

OPTIGA TRUST E EMBEDDED SECURITY

0
IDP12E120XKSA1390

IDP12E120XKSA1390

IR (Infineon Technologies)

IDP12E120 - SILICON POWER DIODE

150
IPP60R600C6

IPP60R600C6

IR (Infineon Technologies)

7.3A, 600V, 0.6OHM, N-CHANNEL MO

0
PSB7530ZDW-552

PSB7530ZDW-552

IR (Infineon Technologies)

PSB7530ZDW-552

9025
SAF-XC87813FFA5VACFXUMA1

SAF-XC87813FFA5VACFXUMA1

IR (Infineon Technologies)

XC800 I-FAMILY MICROCONTROLLER ,

1293
IPP60R090CFD7

IPP60R090CFD7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
BCR129E6327

BCR129E6327

IR (Infineon Technologies)

BCR129 - DIGITAL TRANSISTOR

6000
IPA65R125C7

IPA65R125C7

IR (Infineon Technologies)

IPA65R125 - 650V AND 700V COOLMO

412

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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