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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
CY7C9611-NC

CY7C9611-NC

IR (Infineon Technologies)

IC PHYSICAL LAYER DEVICE

291
IPD25N06S2-40ATMA1

IPD25N06S2-40ATMA1

IR (Infineon Technologies)

IPD25N06 - 55V-60V N-CHANNEL AUT

20000
TLE94613ESV33XUMA1

TLE94613ESV33XUMA1

IR (Infineon Technologies)

IC TXRX CAN LITE SBC 2MBPS

2869
CG7725AA

CG7725AA

IR (Infineon Technologies)

MICROPOWER SRAMS

27
SAK-XC2268N40F80LRABKXUMA1

SAK-XC2268N40F80LRABKXUMA1

IR (Infineon Technologies)

16-BIT C166 MICROCONTROLLER - XC

0
IPA80R1K4P7

IPA80R1K4P7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
SAK-XC2263M72F80LRABKXUMA1

SAK-XC2263M72F80LRABKXUMA1

IR (Infineon Technologies)

16-BIT C166 MICROCONTROLLER - XC

2000
BTS114AE3045ANTMA1

BTS114AE3045ANTMA1

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 1

26000
IDW60C65D1

IDW60C65D1

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
IPP65R280C6

IPP65R280C6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 6

0
IHW30N65R5

IHW30N65R5

IR (Infineon Technologies)

IHW30N65 - DISCRETE IGBT WITH AN

0
TLI4970-D050T4

TLI4970-D050T4

IR (Infineon Technologies)

TLI4970 - MAGNETIC CURRENT SENSO

1479
IPW60R160P6

IPW60R160P6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
RF3710PBF

RF3710PBF

IR (Infineon Technologies)

IRF3710 - N-CHANNEL POWER MOSFET

0
CY25100ZXC68

CY25100ZXC68

IR (Infineon Technologies)

CLOCKS

3320
TLE9471ESXUMA1

TLE9471ESXUMA1

IR (Infineon Technologies)

TLE9471 - SYSTEM BASIS CHIPS (SB

3000
IPA50R299CPXKSA1079

IPA50R299CPXKSA1079

IR (Infineon Technologies)

IPA50R299 - 500V COOLMOS N-CHANN

13500
IPA60R190C6

IPA60R190C6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 2

0
CY7C9235A-270JXC

CY7C9235A-270JXC

IR (Infineon Technologies)

IC SMPTE ENCODER 44-PLCC

541
BBY5305WH6327XTSA1554

BBY5305WH6327XTSA1554

IR (Infineon Technologies)

BBY53 - VARACTOR DIODE

3000

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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