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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
FM31256-G

FM31256-G

IR (Infineon Technologies)

256-KBIT INTEGRATED PROCESSOR CO

948
PEB2026TPV1.1

PEB2026TPV1.1

IR (Infineon Technologies)

ISDN POWER CONTROLLER

0
FM31L276-G

FM31L276-G

IR (Infineon Technologies)

256-KBIT INTEGRATED PROCESSOR CO

26
IPI65R310CFDXKSA1700

IPI65R310CFDXKSA1700

IR (Infineon Technologies)

IPI65R310 - 650V AND 700V COOLMO

1500
IPA60R125CP

IPA60R125CP

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 2

0
IPP60R060P7

IPP60R060P7

IR (Infineon Technologies)

600V, 0.06OHM, N-CHANNEL MOSFET,

375
SLS32AIA020A2USON10XTMA2

SLS32AIA020A2USON10XTMA2

IR (Infineon Technologies)

OPTIGA TRUST E EMBEDDED SECURITY

0
SP000683158

SP000683158

IR (Infineon Technologies)

SPP11N80C3XKSA1 - COOLMOS N-CHAN

0
PSB7530ZDW

PSB7530ZDW

IR (Infineon Technologies)

PSB7530ZDW

2880
PEF22822ELV2.2

PEF22822ELV2.2

IR (Infineon Technologies)

10BASES-D DIGITAL CHIP

175
SP000685844

SP000685844

IR (Infineon Technologies)

IPP60R125C6XKSA1 - COOLMOS N-CHA

0
IKW40N65H5

IKW40N65H5

IR (Infineon Technologies)

IKW40N65 - DISCRETE IGBT WITH AN

0
BCR133TE6327

BCR133TE6327

IR (Infineon Technologies)

BIPOLAR DIGITAL TRANSISTOR

0
SPA08N80C3

SPA08N80C3

IR (Infineon Technologies)

SPA08N80 - 800V COOLMOS N-CHANNE

250
1EDN8511B

1EDN8511B

IR (Infineon Technologies)

1EDN8511 - GATE DRIVER

1589
CG6897DS

CG6897DS

IR (Infineon Technologies)

ENCORE USB COMBINATION LOW-SPEED

565
SAFXE167H48F66LACFXQMA1

SAFXE167H48F66LACFXQMA1

IR (Infineon Technologies)

16-BIT FLASH RISC MICROCONTROLLE

360
PMB5699

PMB5699

IR (Infineon Technologies)

SMARTI U SINGLE-CHIP W-CDMA/UMTS

0
IPA60R160P6

IPA60R160P6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
TDSTD6895

TDSTD6895

IR (Infineon Technologies)

BCR158 - DIGITAL TRANSISTOR

0

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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