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Specialized ICs

Image Part Number Description / PDF Quantity Rfq
XMC14S2Q040X0064AAXUMA1

XMC14S2Q040X0064AAXUMA1

IR (Infineon Technologies)

32-BIT INDUSTRIAL MICROCONTROLLE

14894
TLE8110EDXUMA1

TLE8110EDXUMA1

IR (Infineon Technologies)

IC LOW-SIDE SWITCH DSO36-72

0
SLJ52ACA150A1VQFN32XUMA1

SLJ52ACA150A1VQFN32XUMA1

IR (Infineon Technologies)

OPTIGA TRUST P

19232
TLE6714G

TLE6714G

IR (Infineon Technologies)

QUAD FIRING AIRBAG IC

100
IPW60R160C6

IPW60R160C6

IR (Infineon Technologies)

23.8A, 600V, 0.16OHM, N-CHANNEL

0
TLE94713ESV33XUMA1

TLE94713ESV33XUMA1

IR (Infineon Technologies)

IC TXRX CAN LITE SBC 2MBPS

2316
TLE493D-A1B6

TLE493D-A1B6

IR (Infineon Technologies)

TLE493 - 3D MAGNETICS

200
IPP65R065C7

IPP65R065C7

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR, 3

0
TLE9471ESV33XUMA1

TLE9471ESV33XUMA1

IR (Infineon Technologies)

IC TXRX CAN LITE SBC 2MBPS

1633
TC1797384F150EFACKXUMA1

TC1797384F150EFACKXUMA1

IR (Infineon Technologies)

TC1797 - RISCSC FLASH MICROCONTR

500
ICE5QR2270AZ

ICE5QR2270AZ

IR (Infineon Technologies)

ICE5QR2270 - QUASI RESONANT COOL

2000
SP000660618

SP000660618

IR (Infineon Technologies)

IPI60R190C6XKSA1 - COOLMOS N-CHA

0
IKQ75N120CT2

IKQ75N120CT2

IR (Infineon Technologies)

IKQ75N120 - DISCRETE IGBT WITH A

0
SP001606042

SP001606042

IR (Infineon Technologies)

IPA60R180P7XKSA1 - 600V COOLMOS

0
IPA60R125P6

IPA60R125P6

IR (Infineon Technologies)

POWER FIELD-EFFECT TRANSISTOR

0
XMC13S2Q024X0032ABXUMA1

XMC13S2Q024X0032ABXUMA1

IR (Infineon Technologies)

32-BIT INDUSTRIAL MICROCONTROLLE

24000
SAK-XC2263N40F80LABKXUMA1

SAK-XC2263N40F80LABKXUMA1

IR (Infineon Technologies)

16-BIT C166 MICROCONTROLLER - XC

0
TLI4946-2L

TLI4946-2L

IR (Infineon Technologies)

TLI4946 - HALL SWITCH

2000
1EDN8550B

1EDN8550B

IR (Infineon Technologies)

1EDN8550 - GATE DRIVER

26500
TLE9461ESXUMA1

TLE9461ESXUMA1

IR (Infineon Technologies)

IC TXRX CAN LITE SBC 2MBPS

3009

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
ASIC (Application-Specific IC) Custom-designed for a specific application with fixed functionality Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array) Reconfigurable logic blocks and interconnects for dynamic functionality 5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip) Integrates CPU, GPU, memory, and peripherals on a single chip Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product) Standardized ICs for specific applications (not fully customized) Networking switches, display drivers, power management
PLD (Programmable Logic Device) Basic programmable ICs for simple logic operations Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

  • Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
  • Transistor Array: Millions to billions of MOSFETs or FinFETs
  • Metal Layers: Multi-layer interconnects for signal routing
  • IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
  • Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter Description Importance
Power Consumption Measured in watts (W) or milliwatts (mW) Determines battery life and thermal management
Operating Frequency Maximum speed (GHz) for signal processing Impacts system performance and latency
Process Node Manufacturing technology (e.g., 7nm, 5nm) Defines transistor density and energy efficiency
Die Size Physical chip dimensions (mm ) Affects cost and integration level
Thermal Resistance Ability to dissipate heat ( C/W) Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

  • Telecommunications: 5G modems, optical transceivers
  • Automotive: ADAS sensors, battery management systems
  • Healthcare: MRI scanners, portable diagnostic devices
  • AI/ML: Neural network accelerators, vision processing units
  • Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer Representative Product Application
Intel Stratix 10 FPGA High-performance computing (HPC)
Xilinx Zynq UltraScale+ MPSoC Autonomous driving and AI
Texas Instruments AFE5805 (Analog Front-End) Medical imaging
Qualcomm SM8350 SoC 5G smartphones
STMicroelectronics STM32MP1 (MPU) Industrial IoT

7. Selection Guidelines

Key considerations:

  • Performance Requirements: Match clock speed and throughput to application needs
  • Power Efficiency: Prioritize low-power designs for battery-operated devices
  • Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
  • Cost: Balance NRE costs vs. volume production economics
  • Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

  • AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
  • Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
  • Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
  • Security Integration: Hardware-based encryption and tamper-proof designs
  • Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs
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