Specialized ICs

Part Number	Description / PDF	Quantity
BGS312MC27-2IE6433XUSA1 IR (Infineon Technologies)	BGS312MC27 - LIMITED DATA AVAILA	0
IPL65R190E6AUMA1938 IR (Infineon Technologies)	IPL65R190 - 650V AND 700V COOLMO	3000
BGS17MC222IE6433XUSA1 IR (Infineon Technologies)	BGS17MC222 - CUSTOMER SPECIAL	0
BGS22WL10E6327XTSA1020 IR (Infineon Technologies)	BGS22WL10 - RF SWITCH	7500
PBM9825/12QNAR1A IR (Infineon Technologies)	PBM9825/12QNAR1A	0
SAF-XC8664FRABEFXUMA1 IR (Infineon Technologies)	XC800 I-FAMILY MICROCONTROLLER ,	0
TC1782F320F180HLBAKXUMA1 IR (Infineon Technologies)	RISC FLASH MICROCONTROLLER, 32-B	332
PXF4222EV1.1 IR (Infineon Technologies)	ATM INTERWORKING CONTROLLER	192
IRS25411STRPBFCT IR (Infineon Technologies)	IRS25411 - LED DRIVER DIMMABLE	2487
IPP60R120P7 IR (Infineon Technologies)	600V, 0.12OHM, N-CHANNEL MOSFET,	0
PBM39714/1MLAR1B IR (Infineon Technologies)	PBM39714 - LIMITED PART DETAILS	0
SAK-TC1797384F150EFACKXUMA1 IR (Infineon Technologies)	RISC FLASH MICROCONTROLLER, 32-B	1000
IPP0400N IR (Infineon Technologies)	IPP0400N	72000
IRFH7440TRPBFTR IR (Infineon Technologies)	IRFH7440 - 12V-300V N-CHANNEL PO	19680
FF400R17KF4CNOSA1 IR (Infineon Technologies)	FF400R17 - IGBT MODULE	0
SAK-XC2060M104F80LAAKXQMA1 IR (Infineon Technologies)	LEGACY 16-BIT XC2000 MICROCONTRO	540
SAK-TC1793S512F270EFABKXUMA2 IR (Infineon Technologies)	RISC FLASH MICROCONTROLLER, 32-B	9500
SAK-C164CI-8RM CA+ IR (Infineon Technologies)	SAK-C164CI-8RM CA+ - LEGACY 16-B	850
PEB204PV1.1 IR (Infineon Technologies)	PEB204PV1.1	0
SAK-XC206096F80LACKXUMA1 IR (Infineon Technologies)	LEGACY 16-BIT XC2000 MICROCONTRO	897

Specialized ICs

1. Overview

Specialized ICs (Application-Specific Integrated Circuits, ASICs) are customized microchips designed for specific functions or applications, unlike general-purpose ICs. They optimize performance, power efficiency, and size for targeted tasks, playing a critical role in modern electronics such as telecommunications, automotive systems, and AI accelerators.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
ASIC (Application-Specific IC)	Custom-designed for a specific application with fixed functionality	Smartphones, IoT devices, medical imaging equipment
FPGA (Field-Programmable Gate Array)	Reconfigurable logic blocks and interconnects for dynamic functionality	5G base stations, industrial automation, prototyping systems
SoC (System-on-Chip)	Integrates CPU, GPU, memory, and peripherals on a single chip	Wearable devices, autonomous vehicles, edge computing
ASSP (Application-Specific Standard Product)	Standardized ICs for specific applications (not fully customized)	Networking switches, display drivers, power management
PLD (Programmable Logic Device)	Basic programmable ICs for simple logic operations	Consumer electronics, automotive sensors

3. Structure and Composition

A typical Specialized IC includes:

Semiconductor Substrate: Silicon wafer with CMOS/BiCMOS processes
Transistor Array: Millions to billions of MOSFETs or FinFETs
Metal Layers: Multi-layer interconnects for signal routing
IP Blocks: Pre-designed modules (e.g., ARM cores, DSP units)
Package: BGA, QFN, or flip-chip for thermal/electrical performance

4. Key Technical Specifications

Parameter	Description	Importance
Power Consumption	Measured in watts (W) or milliwatts (mW)	Determines battery life and thermal management
Operating Frequency	Maximum speed (GHz) for signal processing	Impacts system performance and latency
Process Node	Manufacturing technology (e.g., 7nm, 5nm)	Defines transistor density and energy efficiency
Die Size	Physical chip dimensions (mm )	Affects cost and integration level
Thermal Resistance	Ability to dissipate heat ( C/W)	Crucial for reliability in high-performance applications

5. Application Fields

Main industries and equipment:

Telecommunications: 5G modems, optical transceivers
Automotive: ADAS sensors, battery management systems
Healthcare: MRI scanners, portable diagnostic devices
AI/ML: Neural network accelerators, vision processing units
Industrial: Smart meters, robotics controllers

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Application
Intel	Stratix 10 FPGA	High-performance computing (HPC)
Xilinx	Zynq UltraScale+ MPSoC	Autonomous driving and AI
Texas Instruments	AFE5805 (Analog Front-End)	Medical imaging
Qualcomm	SM8350 SoC	5G smartphones
STMicroelectronics	STM32MP1 (MPU)	Industrial IoT

7. Selection Guidelines

Key considerations:

Performance Requirements: Match clock speed and throughput to application needs
Power Efficiency: Prioritize low-power designs for battery-operated devices
Scalability: Choose programmable solutions (e.g., FPGA) for future upgrades
Cost: Balance NRE costs vs. volume production economics
Compatibility: Ensure package footprint and voltage levels align with system design

8. Industry Trends

Emerging trends include:

AI-Optimized ICs: Development of dedicated AI accelerators (e.g., TPUs)
Advanced Packaging: Adoption of 2.5D/3D stacking for higher integration
Energy Efficiency: Focus on sub-1V operation and RISC-V-based architectures
Security Integration: Hardware-based encryption and tamper-proof designs
Heterogeneous Computing: Combining CPU/GPU/NPU cores in single SoCs