PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LM5068MMX-2/NOPB

LM5068MMX-2/NOPB

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT, FI

1339

TPS2350PWG4

TPS2350PWG4

Texas Instruments

TPS2350 HOT SWAP POWER MANAGER F

2838

LM5069MMX-2/NOPB

LM5069MMX-2/NOPB

Texas Instruments

LM5069 POSITIVE HIGH VOLTAGE HOT

4572

TPS2490DGSR

TPS2490DGSR

Texas Instruments

TPS2490 LATCHABLE POSITIVE HIGH-

6724

TPS24770RGET

TPS24770RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

143

TPS24741RGER

TPS24741RGER

Texas Instruments

TPS24741 TPS24741 2.5 TO 18-V HI

41457

TPS24710DGSR

TPS24710DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

UCC3912DPG4

UCC3912DPG4

Texas Instruments

UCC3912 0-3A, 3-8V SINGLE HOT-SW

0

TPS2342PFPR

TPS2342PFPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

15000

TPS2483PWR

TPS2483PWR

Texas Instruments

TPS2483 36-V HOT SWAP CONTROLLER

3358

TPS24741RGET

TPS24741RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

163

UCC2915DP

UCC2915DP

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

72

TPS2331IPWR

TPS2331IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

734

LM5069MM-2-TI

LM5069MM-2-TI

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT, AD

15274

TPS24771RGER

TPS24771RGER

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

0

UC3914DW

UC3914DW

Texas Instruments

IC HOT SWAP CTRLR GP 18SOIC

66

UC3914DWTR

UC3914DWTR

Texas Instruments

UC3914 5-35V SINGLE, HOT-SWAP IC

28694

UCC3912DP

UCC3912DP

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

50

TPS2359RHHT

TPS2359RHHT

Texas Instruments

IC HOT SWAP CTRLR ATCA 36VQFN

244

TPS2343DDPR

TPS2343DDPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

51983

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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