PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2391DGKRG4

TPS2391DGKRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

TPS2391DGKR

TPS2391DGKR

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

2288

TPS2321IPWR

TPS2321IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

TPS2420RSAT

TPS2420RSAT

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

170

TPS2359RHHTG4

TPS2359RHHTG4

Texas Instruments

IC HOT SWAP CTRLR ATCA 36VQFN

0

TPS2421-1DDA

TPS2421-1DDA

Texas Instruments

IC HOT SWAP CTRLR GP 8SOPWR

442

UCC2919DG4

UCC2919DG4

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

0

TPS2330IPWG4

TPS2330IPWG4

Texas Instruments

TPS2330 3-13V SINGLE HOT-SWAP IC

55

TPS2330IPWR

TPS2330IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

949

HPC3130APGE

HPC3130APGE

Texas Instruments

PCI BUS CONTROLLER

710

UCC3912DPTR

UCC3912DPTR

Texas Instruments

UCC3912 0-3A, 3-8V SINGLE HOT-SW

125000

TPS24711DGSR

TPS24711DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

323

UCC3916DPTR

UCC3916DPTR

Texas Instruments

UCC3916 1.65A, 4-6V SINGLE HOT-S

125000

TPS2311IPW

TPS2311IPW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

210

LM5067MM-1/NOPB

LM5067MM-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 10VSSOP

80

LM5066IPMHX/NOPB

LM5066IPMHX/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

0

TPS2394PW

TPS2394PW

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

19

TPS2456RHHR

TPS2456RHHR

Texas Instruments

TPS2456 DUAL 12V PROTECTION AND

174968

TPS2456ARHHR

TPS2456ARHHR

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

0

LM25069PMM-1/NOPB

LM25069PMM-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

1020

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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