PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS24751RUVT

TPS24751RUVT

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

0

TPS2399D

TPS2399D

Texas Instruments

IC CTLR HOT SWAP -48V 8VSSOP

7680

TPS2399DGK

TPS2399DGK

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

430

UCC3917D

UCC3917D

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

8713

TPS2491DGSG4

TPS2491DGSG4

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

UCC3921DTR

UCC3921DTR

Texas Instruments

UCC3921 LATCHABLE NEGATIVE FLOAT

22500

LM5069MMX-1/NOPB

LM5069MMX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

2396

UCC3912PWPG4

UCC3912PWPG4

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

LM5069MM-2/NOPB

LM5069MM-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

UCC3921D/81143

UCC3921D/81143

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

0

LM25069PMME-2/NOPB

LM25069PMME-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

1364

TPS2421-1DDAR

TPS2421-1DDAR

Texas Instruments

IC HOT SWAP CTRLR GP 8SOPWR

13476

HPC3130APBK

HPC3130APBK

Texas Instruments

PCI HOT PLUG CONTROLLER, PLASTIC

1080

TPS2340APFPR

TPS2340APFPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

11000

TPS2492PW

TPS2492PW

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

535

SN24710DGSR

SN24710DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

LM25061PMMX-2/NOPB

LM25061PMMX-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

UCC3919D

UCC3919D

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

13677

TPS2482PW

TPS2482PW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

997

LM25061PMMX-1/NOPB

LM25061PMMX-1/NOPB

Texas Instruments

LM25061 POSITIVE LOW VOLTAGE POW

10500

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

RFQ BOM Call Skype Email
Top