PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LM5068MM-2/NOPB

LM5068MM-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

434

LM5064PMHE/NOPB

LM5064PMHE/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 28HTSSOP

271

TPS2392PWR

TPS2392PWR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

12100

UCC2919DTR

UCC2919DTR

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

27500

TPS2350DR

TPS2350DR

Texas Instruments

IC HOT SWAP CTRLR -48V 14SOIC

0

TPS24711DGS

TPS24711DGS

Texas Instruments

TPS24711 2.5V TO 18V HIGH EFFICI

800

TPS24742RGER

TPS24742RGER

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

0

TPS2490DGS

TPS2490DGS

Texas Instruments

TPS2490 LATCHABLE POSITIVE HIGH-

284

TPS2399DGKG4

TPS2399DGKG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

TPS24712DGSR

TPS24712DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

UCC3915N

UCC3915N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

1150

LM25069PMMX-2/NOPB

LM25069PMMX-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

HPC3130PBM

HPC3130PBM

Texas Instruments

PCI BUS CONTROLLER, CMOS

3911

TPS24740RGER

TPS24740RGER

Texas Instruments

TPS24740 2.5 TO 18-V HIGH PERFOR

39928

UCC3913N

UCC3913N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

7946

TPS2359RHHR

TPS2359RHHR

Texas Instruments

IC HOT SWAP CTRLR ATCA 36VQFN

620

TPS2350PWRG4

TPS2350PWRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

UCC3912PWPTR

UCC3912PWPTR

Texas Instruments

PROG HOT SWAP PWR MANAGER

8000

TPS2399DGKR

TPS2399DGKR

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

678

TPS24751RUVR

TPS24751RUVR

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

RFQ BOM Call Skype Email
Top