PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
UCC3912DP/81218

UCC3912DP/81218

Texas Instruments

ANALG VOLT REF & OTHER

250

TPS2393DBTR

TPS2393DBTR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

4000

LM5066PMHE/NOPB

LM5066PMHE/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

213

TPS2321IDR

TPS2321IDR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

39795

TPS2330IPW

TPS2330IPW

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

15

TPS23525PWT

TPS23525PWT

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

0

TPS2482PWR

TPS2482PWR

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

UCC2918DP/81510

UCC2918DP/81510

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

851

TPS2390DGKR

TPS2390DGKR

Texas Instruments

TPS2390 SIMPLE -48V HOT SWAP CON

0

TPS2310IPWR

TPS2310IPWR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

32000

UCC2912DP

UCC2912DP

Texas Instruments

UCC2912 PROGRAMMABLE HOT SWAP SW

422

UCC2912PWP

UCC2912PWP

Texas Instruments

UCC2912 PROGRAMMABLE HOT SWAP SW

18970

TPS25910RSAT

TPS25910RSAT

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

1663

TPS2490DGSG4

TPS2490DGSG4

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2350PW

TPS2350PW

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

143

TPS2320IPWRG4

TPS2320IPWRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

TPS24772RGER

TPS24772RGER

Texas Instruments

TPS24772 2.5 TO 18-V HIGH PERFOR

0

TPS2393PWR

TPS2393PWR

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

LM50672NPAR

LM50672NPAR

Texas Instruments

-9-V TO -80-V HOT SWAP CONTROLLE

999

TPS2393DBT

TPS2393DBT

Texas Instruments

TPS2393 FULL FEATURED -48V HOT S

6611

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

RFQ BOM Call Skype Email
Top