PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2358RGZR

TPS2358RGZR

Texas Instruments

IC HOT SWAP CTRLR ATCA 48VQFN

0

TPS2458RHBR

TPS2458RHBR

Texas Instruments

TPS2458 12V / 3.3V HOT SWAP AND

8126

TPS24712DGS

TPS24712DGS

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

LM5066PMHX/NOPB

LM5066PMHX/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

549

UCC3915DPG4

UCC3915DPG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

TPS2350D

TPS2350D

Texas Instruments

TPS2350 HOT SWAP POWER MANAGER F

1488

UCC3919DTR

UCC3919DTR

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

25000

TPS2320IDR

TPS2320IDR

Texas Instruments

TPS2320 3-13V DUAL HOT-SWAP IC W

10000

LM5064PMH/NOPB

LM5064PMH/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 28HTSSOP

0

TPS2345PW

TPS2345PW

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

643

TPS2330IDRG4

TPS2330IDRG4

Texas Instruments

IC HOT SWAP CTRLR GP 14SOIC

0

TPS2300IPWR

TPS2300IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

TPS24720RGTT

TPS24720RGTT

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

206

UCC3917N

UCC3917N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

12535

TPS2398DGKG4

TPS2398DGKG4

Texas Instruments

TPS2398 -48V HOT SWAP CONTROLLER

60

LM25069PMM-2/NOPB

LM25069PMM-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

1844

UCC3921D

UCC3921D

Texas Instruments

IC HOT SWAP CTRLR GP 8SOIC

27

TPS2300IPW

TPS2300IPW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

20

TPS2340APFP

TPS2340APFP

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

3238

TPS2391DGK

TPS2391DGK

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

35

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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