PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2363PFB

TPS2363PFB

Texas Instruments

TPS2363 PCIEXPRESS SERVER DUAL S

19224

TPS2301IPW

TPS2301IPW

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

10

TPS24740RGET

TPS24740RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

88

TPS2321IPW

TPS2321IPW

Texas Instruments

TPS2321 3-13V DUAL HOT-SWAP IC W

19311

TPS23523PWT

TPS23523PWT

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

230

UCC3921DTR/81143

UCC3921DTR/81143

Texas Instruments

UCC3921 LATCHABLE NEGATIVE FLOAT

50658

TPS2331IDRG4

TPS2331IDRG4

Texas Instruments

IC HOT SWAP CTRLR GP 14SOIC

0

TPS2320IDRG4

TPS2320IDRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

LM5069MMX-1

LM5069MMX-1

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2301IPWRG4

TPS2301IPWRG4

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

LM5068MM-1

LM5068MM-1

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

LM5068MMX-3

LM5068MMX-3

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

TPS2321IDRG4

TPS2321IDRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

TPS2398DGKR

TPS2398DGKR

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

LM5068MMX-4

LM5068MMX-4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

LM5068MMX-1/NOPB

LM5068MMX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC2912DPRG4

UCC2912DPRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC3921D/81143G4

UCC3921D/81143G4

Texas Instruments

IC HOT SWAP CTRLR GP 8SOIC

0

LM5069MMX-2

LM5069MMX-2

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

HPC3130APGEG4

HPC3130APGEG4

Texas Instruments

IC HOT PLUG CTRLR PCI 144LQFP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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