PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
UCC2913DTRG4

UCC2913DTRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8SOIC

0

TPS2320IDG4

TPS2320IDG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC3919PWG4

UCC3919PWG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

LM5068MM-4

LM5068MM-4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

TPS2398DGKRG4

TPS2398DGKRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC2917DTRG4

UCC2917DTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC2912PWPR

UCC2912PWPR

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

UCC2917DG4

UCC2917DG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

TPS2346PWRG4

TPS2346PWRG4

Texas Instruments

IC HOT SWAP CTRLR ONET 24TSSOP

0

UCC3915NG4

UCC3915NG4

Texas Instruments

IC HOT SWAP CTRLR GP 16DIP

0

TPS2342PFPG4

TPS2342PFPG4

Texas Instruments

IC HOT PLUG CTRLR PCI 80HTQFP

0

UCC2913NG4

UCC2913NG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8DIP

0

UCC39151DPTR

UCC39151DPTR

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC3913DTRG4

UCC3913DTRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8SOIC

0

UCC2912DPR

UCC2912DPR

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

LM5068MM-3

LM5068MM-3

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC2912PWPRG4

UCC2912PWPRG4

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

LM5068MM-2

LM5068MM-2

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC3915PWPTRG4

UCC3915PWPTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

TPS2306DW

TPS2306DW

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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