PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
SN24710DGS

SN24710DGS

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2320ID

TPS2320ID

Texas Instruments

TPS2320 3-13V DUAL HOT-SWAP IC W

26248

LM5067MWX-1/NOPB

LM5067MWX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 14SOIC

0

TPS24700DGKR

TPS24700DGKR

Texas Instruments

IC HOT SWAP CTRLR GP 8VSSOP

3614

TPS2421-2DDAR

TPS2421-2DDAR

Texas Instruments

IC HOT SWAP CTRLR GP 8SOPWR

0

TPS23523PWR

TPS23523PWR

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

0

TPS2320IPWG4

TPS2320IPWG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

TPS24770RGER

TPS24770RGER

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

0

LM25061PMME-1/NOPB

LM25061PMME-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

844

UCC3918DPG4

UCC3918DPG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

TPS2393APWRG4

TPS2393APWRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

TPS2590RSAT

TPS2590RSAT

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

0

TPS2459RHBR

TPS2459RHBR

Texas Instruments

IC HOT SWAP CTRLR ATCA 32VQFN

0

TPS2320IPWR

TPS2320IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

LM5067MM-2/NOPB

LM5067MM-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 10VSSOP

9988

TPS2456ARHHT

TPS2456ARHHT

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

249

TPS24710DGS

TPS24710DGS

Texas Instruments

TPS24710 2.5V TO 18V HIGH EFFICI

169

LM25061PMM-2/NOPB

LM25061PMM-2/NOPB

Texas Instruments

LM25061 POSITIVE LOW VOLTAGE POW

11101

UCC2921DTR

UCC2921DTR

Texas Instruments

IC HOT SWAP CTRLR GP 8SOIC

1900

TPS2301IPWR

TPS2301IPWR

Texas Instruments

TPS2301 3-13V DUAL HOTSWAP IC W/

3831

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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