PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2311IPWR

TPS2311IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

TPS2491DGSR

TPS2491DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

LM5066IPMHE/NOPB

LM5066IPMHE/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

0

TPS2392PW

TPS2392PW

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT, AD

16085

TPS24720RGTR

TPS24720RGTR

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

3654

TPS2421-2DDA

TPS2421-2DDA

Texas Instruments

IC HOT SWAP CTRLR GP 8SOPWR

572

TPS2481PW

TPS2481PW

Texas Instruments

TPS2481 POSITIVE VOLTAGE, INTELL

70

TPS2480PWR

TPS2480PWR

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

TPS2331IDR

TPS2331IDR

Texas Instruments

TPS2331 3-13V SINGLE HOT-SWAP IC

1042

LM5067MW-1/NOPB

LM5067MW-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 14SOIC

181

TPS2363PFBR

TPS2363PFBR

Texas Instruments

IC HOT PLUG CTRLR PCI EXP 48TQFP

355

TPS2481PWR

TPS2481PWR

Texas Instruments

TPS2481 POSITIVE VOLTAGE, INTELL

1712

LM25061PMM-1/NOPB

LM25061PMM-1/NOPB

Texas Instruments

LM25061 POSITIVE LOW VOLTAGE POW

2000

TPS2331ID

TPS2331ID

Texas Instruments

IC HOT SWAP CTRLR GP 14SOIC

241

TPS2390DGK

TPS2390DGK

Texas Instruments

TPS2390 SIMPLE -48V HOT SWAP CON

34673

UCC2917DTR

UCC2917DTR

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

7128

UCC3918DP

UCC3918DP

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

70

TPS2420RSAR

TPS2420RSAR

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

0

TPS259807ONRGER

TPS259807ONRGER

Texas Instruments

2.7-V TO 24-V, 8-A, 3-M SMART EF

22

TPS2490DGSRG4

TPS2490DGSRG4

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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