PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
UC3914DWTRG4

UC3914DWTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 18SOIC

0

UCC2917N

UCC2917N

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

21700

TPS24771RGET

TPS24771RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

262

TPS23521PWT

TPS23521PWT

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

122

UCC3919PW

UCC3919PW

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

19675

TCA4307DGKR

TCA4307DGKR

Texas Instruments

HOT SWAPPABLE I2C BUS AND SMBUS

1912

LM5064PMHX/NOPB

LM5064PMHX/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 28HTSSOP

0

TPS2350PWR

TPS2350PWR

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

TPS2350DG4

TPS2350DG4

Texas Instruments

TPS2350 HOT SWAP POWER MANAGER F

40

TPS2493PW

TPS2493PW

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

1851

TPS24701DGK

TPS24701DGK

Texas Instruments

IC HOT SWAP CTRLR GP 8VSSOP

2598

UCC3913DTR

UCC3913DTR

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

9755

TPS2363PFBG4

TPS2363PFBG4

Texas Instruments

IC HOT PLUG CTRLR PCI EXP 48TQFP

0

LM25069PMME-1/NOPB

LM25069PMME-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2342PFP

TPS2342PFP

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

1376

TPS2390DGKG4

TPS2390DGKG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

TPS2301IPWG4

TPS2301IPWG4

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

205

TPS2492PWR

TPS2492PWR

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

2358

LM25069PMMX-1/NOPB

LM25069PMMX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2330ID

TPS2330ID

Texas Instruments

TPS2330 3-13V SINGLE HOT-SWAP IC

5692

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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