PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
UCC3919PWTRG4

UCC3919PWTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

TPS2343DDPG3

TPS2343DDPG3

Texas Instruments

IC HOT PLUG CTRLR PCI 80HTSSOP

0

UCC2919DTRG4

UCC2919DTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC2915DPTRG4

UCC2915DPTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC3917DG4

UCC3917DG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC3913NG4

UCC3913NG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8DIP

0

LM5068MMX-1

LM5068MMX-1

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

LM5068MMX-2

LM5068MMX-2

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC3919PWTR

UCC3919PWTR

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

TPS2393DBTRG4

TPS2393DBTRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 44TSSOP

0

UCC2912NG4

UCC2912NG4

Texas Instruments

IC HOT SWAP CTRLR GP 16DIP

0

UCC2917NG4

UCC2917NG4

Texas Instruments

IC HOT SWAP CTRLR GP 16DIP

0

UCC3917NG4

UCC3917NG4

Texas Instruments

IC HOT SWAP CTRLR GP 16DIP

0

UCC3917DTRG4

UCC3917DTRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

UCC2919PWG4

UCC2919PWG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

LM5068MMX-3/NOPB

LM5068MMX-3/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

UCC3919DG4

UCC3919DG4

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

0

LM5067MMX-1/NOPB

LM5067MMX-1/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 10VSSOP

0

UCC39151PWPTR

UCC39151PWPTR

Texas Instruments

IC HOT SWAP CTRLR GP 24HTSSOP

0

TPS2340APFPG4

TPS2340APFPG4

Texas Instruments

IC HOT PLUG CTRLR PCI 80HTQFP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

RFQ BOM Call Skype Email
Top