PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC1646IGN#TRPBF

LTC1646IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

0

TPS2483PWR

TPS2483PWR

Texas Instruments

TPS2483 36-V HOT SWAP CONTROLLER

3358

LTC4217IDHC-12#TRPBF

LTC4217IDHC-12#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

0

TPS24741RGET

TPS24741RGET

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

163

UCC2915DP

UCC2915DP

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

72

ISL61851BIBZ

ISL61851BIBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

LTC4283HUHF#TRPBF

LTC4283HUHF#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LTC4284HUHG#PBF

LTC4284HUHG#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR TELECOM 44QFN

25

TPS2331IPWR

TPS2331IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

734

LT4250HIN8#PBF

LT4250HIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

LM5069MM-2-TI

LM5069MM-2-TI

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT, AD

15274

LTC4224IDDB-1#TRPBF

LTC4224IDDB-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10DFN

0

ISL61851GIBZ-T

ISL61851GIBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

ISL61853GCRZ-T

ISL61853GCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5911ESA+

MAX5911ESA+

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

4700

TPS24771RGER

TPS24771RGER

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

0

LTC1421IG#PBF

LTC1421IG#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

UCC3916DP

UCC3916DP

UCC3916 1.65A, 4-6V SINGLE HOT-S

9598

LT4256-3IGN#TRPBF

LT4256-3IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

2444

LTC4227CUFD-3#PBF

LTC4227CUFD-3#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

63

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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