PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2359RHHT

TPS2359RHHT

Texas Instruments

IC HOT SWAP CTRLR ATCA 36VQFN

244

LTC1643AHCGN#PBF

LTC1643AHCGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTR MOTHERBRD 16SSOP

0

LTC4217CFE#TRPBF

LTC4217CFE#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20TSSOP

0

ISL61852HCRZ

ISL61852HCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LT4250HCS8#PBF

LT4250HCS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

24

ISL61863BIRZ-T

ISL61863BIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

HIP1011ACB-T

HIP1011ACB-T

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

2500

MAX5934AEEE+T

MAX5934AEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5955AUEE+

MAX5955AUEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

73500

ISL61852DCRZ

ISL61852DCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LTC4225IGN-1#PBF

LTC4225IGN-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

LTC4227CUFD-2#TRPBF

LTC4227CUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

DS4560S-LO+T

DS4560S-LO+T

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

0

TPS2343DDPR

TPS2343DDPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

51983

TPS2391DGKRG4

TPS2391DGKRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

LTC4231IMS-1#TRPBF

LTC4231IMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

0

TPS2391DGKR

TPS2391DGKR

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

2288

LTC4251BIS6-2#TRPBF

LTC4251BIS6-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V TSOT23-6

0

LTC4235IUFD-2#TRPBF

LTC4235IUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

MAX5901LAEUT

MAX5901LAEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

3094

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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