PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LT1641-2IS8#PBF

LT1641-2IS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

970

MAX5926EEE+T

MAX5926EEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

2500

UCC2919DG4

UCC2919DG4

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

0

TPS2330IPWG4

TPS2330IPWG4

Texas Instruments

TPS2330 3-13V SINGLE HOT-SWAP IC

55

LTC4228CUFD-2#TRPBF

LTC4228CUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

ISL61853NCRZ

ISL61853NCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4215IUFD-1#TRPBF

LTC4215IUFD-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

LTC4252BCMS-2#PBF

LTC4252BCMS-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

30

MIC2587R-1YM-TR

MIC2587R-1YM-TR

Roving Networks / Microchip Technology

IC HOT SWAP CTRLR GP 8SOIC

520

MAX5904USA+

MAX5904USA+

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 8SOIC

49

TPS2330IPWR

TPS2330IPWR

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

949

LTC4219IDHC-12#PBF

LTC4219IDHC-12#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

3445

LTC1421ISW#PBF

LTC1421ISW#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

29

HPC3130APGE

HPC3130APGE

Texas Instruments

PCI BUS CONTROLLER

710

MAX5947AESA+

MAX5947AESA+

Maxim Integrated

IC HOT SWAP CTRLR GP 8SOIC

86

MIC2588-1YM

MIC2588-1YM

Roving Networks / Microchip Technology

SINGLE-CHANNEL, NEGATIVE HIGH-VO

942

LTC4280CUFD#TRPBF

LTC4280CUFD#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

MAX5957AETN+

MAX5957AETN+

Analog Devices, Inc.

POWER SUPPLY SUPPORT CIRCUIT, AD

794

MAX5900ABEUT-T

MAX5900ABEUT-T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

0

LTC4212IMS#PBF

LTC4212IMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

314

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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