PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
UC3914DW

UC3914DW

Texas Instruments

IC HOT SWAP CTRLR GP 18SOIC

66

ISL61851DIBZ-T

ISL61851DIBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

MAX5917AESE+

MAX5917AESE+

Maxim Integrated

IC HOT SWAP CTR NETWORKNG 16SOIC

133

ADM1073ARUZ

ADM1073ARUZ

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 14TSSOP

186

AP2337SA-7

AP2337SA-7

Zetex Semiconductors (Diodes Inc.)

IC HOT SWAP CTRLR GP SOT23-3

3871

ADM1275-3ARQZ-R7

ADM1275-3ARQZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QSOP

0

ADM1172-2AUJZ-RL7

ADM1172-2AUJZ-RL7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP TSOT23-8

5930

ISL61863KCRZ

ISL61863KCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

UC3914DWTR

UC3914DWTR

Texas Instruments

UC3914 5-35V SINGLE, HOT-SWAP IC

28694

LTC4233CWHH#TRPBF

LTC4233CWHH#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

UCC3912DP

UCC3912DP

Texas Instruments

IC HOT SWAP CTRLR GP 16SOIC

50

LTC4231HMS-2#TRPBF

LTC4231HMS-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

0

ISL61852FCRZ

ISL61852FCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LT1640HCS8#PBF

LT1640HCS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

200

MAX5946LETX

MAX5946LETX

Analog Devices, Inc.

PCI EXPRESS HOT-PLUG CONTROLLER

4521

LTM9100IY#PBF

LTM9100IY#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 42BGA

7

ISL61852BIRZ-T

ISL61852BIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

MAX5915AEUI+

MAX5915AEUI+

Analog Devices, Inc.

HOT-SWAP CONTROLLER

100

MAX5900AAEUT

MAX5900AAEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

5330

MAX5925AEUB+

MAX5925AEUB+

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

70

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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