PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS24710DGSR

TPS24710DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

MAX5925DEUB+T

MAX5925DEUB+T

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

0

MAX5907EEE

MAX5907EEE

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

3746

LTC4252-2IMS#TRPBF

LTC4252-2IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LTC4231IMS-2#PBF

LTC4231IMS-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

37

MAX5916EUI

MAX5916EUI

Analog Devices, Inc.

DUAL PCI 2.2 HOT-SWAP CONTROLLER

5264

ISL61853DCRZ

ISL61853DCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5914AEMH+T

MAX5914AEMH+T

Maxim Integrated

IC HOT SWAP CTR PWR OVER 44MQFP

0

ADM1278-1BCPZ-RL

ADM1278-1BCPZ-RL

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32LFCSP

0

ISL61852DCRZ-T

ISL61852DCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

UCC3912DPG4

UCC3912DPG4

Texas Instruments

UCC3912 0-3A, 3-8V SINGLE HOT-SW

0

TPS2342PFPR

TPS2342PFPR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

15000

ISL61851AIBZ

ISL61851AIBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

ISL61853EIRZ

ISL61853EIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MIC2589R-2YM

MIC2589R-2YM

Roving Networks / Microchip Technology

HOT SWAP POWER CONTROLLER

4078

LTC4223CGN-2#PBF

LTC4223CGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

55

MAX5939AESA+

MAX5939AESA+

Analog Devices, Inc.

MAX5939 -48V HOT-SWAP CONTROLLER

100

MAX5902LCEUT

MAX5902LCEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

12912

LTC4224CDDB-2#TRPBF

LTC4224CDDB-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10DFN

0

LTC4231IUD-2#TRPBF

LTC4231IUD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12QFN

2053

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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