PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
ISL6140CB

ISL6140CB

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

1261

ISL61852ECRZ-T

ISL61852ECRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

ISL6115CB

ISL6115CB

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

3346

MAX5978ETJ+T

MAX5978ETJ+T

Maxim Integrated

IC HOT SWAP CTRLR GP 32TQFN

2500

LTC4214-1IMS#TRPBF

LTC4214-1IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

LTC4240CGN#PBF

LTC4240CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 28SSOP

0

ISL61862CCRZ

ISL61862CCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LT1640ALCS8#TRPBF

LT1640ALCS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

ISL61862HCRZ

ISL61862HCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

TPS24741RGER

TPS24741RGER

Texas Instruments

TPS24741 TPS24741 2.5 TO 18-V HI

41457

LTC4253CGN#TRPBF

LTC4253CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 16SSOP

0

LTC4238IUFD#PBF

LTC4238IUFD#PBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

86

LTC4227CUFD-4#TRPBF

LTC4227CUFD-4#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

LTC4238CGN#TRPBF

LTC4238CGN#TRPBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

0

LT4254IGN#PBF

LT4254IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

356

MAX5904USA+T

MAX5904USA+T

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 8SOIC

0

MAX5902NNETT+

MAX5902NNETT+

Analog Devices, Inc.

MAX5902 +72V TDFN, SIMPLE SWAPPE

0

LTC1421IG-2.5#PBF

LTC1421IG-2.5#PBF

HOT SWAP CONTROLLER

885

ISL6150CB-T

ISL6150CB-T

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

2500

LTC4261IGN-2#PBF

LTC4261IGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28SSOP

39

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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