Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CY74FCT2652CTQC Texas Instruments	BUS TRANSCEIVER, FCT SERIES	6862
SN74AVCH8T245PWR Texas Instruments	IC TRANSLATION TXRX 3.6V 24TSSOP	4236
SN74LVC1G125DCK6 Texas Instruments	SINGLE BUS BUFFER GATEWITH 3 STA	99000
74ACT16240DL Texas Instruments	IC BUFFER INVERT 5.5V 48SSOP	206
74ACT16640DL Texas Instruments	BUS TRANSCEIVER	145
SN74AS648DW Texas Instruments	IC TXRX INVERT 5.5V 24SOIC	9446
SN74AUC2G34YEPR Texas Instruments	IC BUFFER NON-INVERT 2.7V 6DSBGA	9000
CD4010BNSR Texas Instruments	IC BUFFER NON-INVERT 18V 16SO	10888
SN74AVCH24T245GRGR Texas Instruments	IC TRANSLATION TXRX 3.6V 83BGA	11607
CY74FCT2374ATQC Texas Instruments	BUS DRIVER, FCT SERIES	1970
SN74LVT244BPWR Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	32418
SN74AUP3G07DCUR Texas Instruments	IC BUFFER NON-INVERT 3.6V 8VSSOP	77229
SN74LS07D Texas Instruments	IC BUF NON-INVERT 5.25V 14SOIC	1239
SN74AS575NT Texas Instruments	BUS DRIVER, AS SERIES, 8-BIT,	4397
SN74HC652DW Texas Instruments	IC TXRX NON-INVERT 6V 24SOIC	1765
SN74F541NS Texas Instruments	IC BUFF/DVR TRI-ST 8BIT 20SO	2680
SN74LV244ADWRG4 Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	0
74ALVTH16244GRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 48TSSOP	0
SN74LVC125APW Texas Instruments	IC BUF NON-INVERT 3.6V 14TSSOP	11597
CD74HC646EN Texas Instruments	IC TXRX NON-INVERT 6V 24DIP	989

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications