Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ALVTH162244DL Texas Instruments	IC BUFFER NON-INVERT 3.6V 48SSOP	365
SN74HC541DW Texas Instruments	IC BUFFER NON-INVERT 6V 20SOIC	1841
SN74ALVCH16863DGGR Texas Instruments	IC TXRX NON-INVERT 3.6V 56TSSOP	35992
SNJ54S373J Texas Instruments	54S373 OCTAL D-TYPE TRANSPARENT	20
SN74LVT244BZQNR Texas Instruments	IC BUFFER NON-INVERT 3.6V 20BGA	8192
SN74LVC2G126DCTRE4 Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	3860
5962-9461801Q2A Texas Instruments	SN54ABT623A OCTAL BUS TRANSCEIVE	116
SN74ALS29823NT Texas Instruments	BUS DRIVER, ALS SERIES	70
SN74AUP1G17DCKR Texas Instruments	IC BUF NON-INVERT 3.6V SC70-5	13867
SN74AS1034AN Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	1084225
5962-9093701MCA Texas Instruments	SN54BCT125A QUADRUPLE BUS BUFFER	17
SN74S244DWR Texas Instruments	IC BUF NON-INVERT 5.25V 20SOIC	0
CAXC8T245QRHLRQ1 Texas Instruments	IC TRANSLATION TXRX 3.6V 24VQFN	1648
SN74ABTH16244DGGR Texas Instruments	IC BUF NON-INVERT 5.5V 48TSSOP	1162
SN54HCT244J Texas Instruments	54HCT244 OCTAL BUFFERS AND LINE	432
SN74ALVCH16244DGVR Texas Instruments	IC BUF NON-INVERT 3.6V 48TVSOP	16182
JM38510/33203BRA Texas Instruments	54F244 OCTAL BUFFERS/DRIVERS WIT	2341
SN74BCT541ADW Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	50
V62/04723-02YE Texas Instruments	SN74LVTH245A-EP ENHANCED PRODUCT	397
74ACT11374DBLE Texas Instruments	BUS DRIVER, ACT SERIES, 8-BIT,	1000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications