Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LS240NS Texas Instruments	IC BUFFER INVERT 5.25V 20SO	413
SN74AC373DBLE Texas Instruments	BUS DRIVER, AC SERIES, 8-BIT,	2000
SN74ACT241PWR Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	1959
SN74ABT2952ADBR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SSOP	4000
74ACT16540DLR Texas Instruments	IC BUFFER INVERT 5.5V 48SSOP	626
CY74FCT374CTQC Texas Instruments	BUS DRIVER, FCT SERIES	5059
SN74F2245DBR Texas Instruments	BUS TRANSCEIVER	24000
SN74ABT240APWLE Texas Instruments	BUS DRIVER, ABT SERIES, 4-BIT	1968
SN74AHC245DBR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	1944
SN74AUC2G126YZPR Texas Instruments	IC BUFFER NON-INVERT 2.7V 8DSBGA	24000
SN74AHCT126NSR Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOP	0
SN74ABT657ADW Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	20872
SN74AS244N Texas Instruments	BUS DRIVER, AS SERIES	18721
SN74LV245APWG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	0
SN74AHC2G34HDCTR Texas Instruments	BUFFER 3-CH NON-INVERTING CMOS 8	6000
SN74LVC1G07DBVTE4 Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	0
SN74ACT245DB Texas Instruments	BUS TRANSCEIVER	3080
SN74LVC126AD Texas Instruments	IC BUF NON-INVERT 3.6V 14SOIC	1563
SN74AHC125QPWRG4 Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	0
SN74LVC1G17DCKR Texas Instruments	IC BUF NON-INVERT 5.5V SC70-5	40934

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications