Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HC244APW Texas Instruments	IC BUFFER NON-INVERT 6V 20TSSOP	4541
SN74ABT16540ADL Texas Instruments	IC BUFFER INVERT 5.5V 48SSOP	324
SN74AHC126NSR Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOP	3914
SN74ACT240PW Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	1610
SN74AVC8T245PW Texas Instruments	IC TRANSLATION TXRX 3.6V 24TSSOP	873
SN74ALS645ADW Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	282
SN74ABTR2245DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	4000
SN74F125DRG4 Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOIC	2375
5962-9214701M2A Texas Instruments	SN54ABT244 OCTAL BUFFERS DRIVERS	282
CY74FCT163244APVC Texas Instruments	BUS DRIVER, FCT SERIES	3698
SN74ABT657ANT Texas Instruments	IC TXRX NON-INVERT 5.5V 24DIP	1517
SN74LVC540DW Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES, 1	6238
SN74LS07NSR Texas Instruments	IC BUFFER NON-INVERT 5.25V 14SOP	4074
SN74HCS367QPWRQ1 Texas Instruments	IC BUFFER NON-INVERT 6V 16TSSOP	827
SN74LVC2G241DCTR Texas Instruments	IC BUFFER NON-INVERT 5.5V SM8	65966000
74GTLPH306DGVR Texas Instruments	IC BUS TXRX LVTTL-GTLP 24-TVSOP	645
SN74LVTR245DWR Texas Instruments	BUS TRANSCEIVER	5000
SN74LV126ANS Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOP	1648
SN74ALS244CDBR Texas Instruments	IC BUF NON-INVERT 5.5V 20SSOP	930
SN74ABT25245DW Texas Instruments	BUS TRANSCEIVER, ABT SERIES	1562

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications