Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SNJ54LS125AFK Texas Instruments	BUS DRIVER, LS SERIES	0
SN74LV245ARGYR Texas Instruments	IC TXRX NON-INVERT 5.5V 20VQFN	5577
SN74AHC540DBR Texas Instruments	IC BUFFER INVERT 5.5V 20SSOP	883
SN74LVC07APWR Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	224
SN74LVC646DW Texas Instruments	REGISTERED BUS TRANSCEIVER	13800
SN74ABT16244ADGGR Texas Instruments	IC BUF NON-INVERT 5.5V 48TSSOP	2324
SN74ACT244PWG4 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	0
CD74FCT240M96 Texas Instruments	BUS DRIVER, FCT SERIES	4000
JM38510/65753BRA Texas Instruments	54HCT240 OCTAL BUFFERS AND LINE	81
SN74LVC2244DW Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	5875
SN74BCT652NT Texas Instruments	IC TXRX NON-INVERT 5.5V 24DIP	1920
5962-9685301QRA Texas Instruments	SN54AHCT574 OCTAL EDGE-TRIGGERED	119
SN74ABT373DB Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	2821
8400101SA Texas Instruments	SN54ALS574B OCTAL D-TYPE EDGE-TR	19
SN74LVC2G34DCKR Texas Instruments	IC BUF NON-INVERT 5.5V SC70-6	31661
SN74ALVC244NS Texas Instruments	BUS DRIVER, ALVC/VCX/A SERIES	24880
SNJ54ABT373J Texas Instruments	54ABT373 OCTAL TRANSPARENT D-TYP	561
CAHCT244IPWRG4Q1 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	4000
SN74LVCR162245DLR Texas Instruments	IC TXRX NON-INVERT 3.6V 48SSOP	0
SN74AC240N Texas Instruments	IC BUFFER INVERT 6V 20DIP	367

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications