Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVCH16543AZQLR Texas Instruments	IC TXRX NON-INVERT 3.6V 56BGA	17000
CY74FCT2245CTSOCT Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	2000
SN74LVTH241DWRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	0
SN74ABT543ADBR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SSOP	1708
SN74ALS540-1NSR Texas Instruments	IC BUFFER INVERT 5.5V 20SO	2000
SN74LVC541ADWRE4 Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	0
SN74ABT16623DLR Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	25800
SN74HC126PWTG4 Texas Instruments	IC BUFFER NON-INVERT 6V 14TSSOP	0
SN74LVTH16541DL Texas Instruments	IC BUFFER NON-INVERT 3.6V 48SSOP	13926
CY74FCT163245CPACT Texas Instruments	BUS TRANSCEIVER, FCT SERIES	56000
SN74AUP2G125RSER Texas Instruments	IC BUFFER NON-INVERT 3.6V 8UQFN	214500
SN74ABTH16245DL Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	287
SN74ALS374AN3 Texas Instruments	BUS DRIVER, ALS SERIES	3092
SN75454BPSR Texas Instruments	IC PERIPHERAL DRIVER 5.25V 8SO	11990
SN74AHCT541PWE4 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	0
SN74HC646DWR Texas Instruments	IC TXRX NON-INVERT 6V 24SOIC	2000
74AC16245DLR Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	2440
SN74ABT16657DL Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	0
CY74FCT2245CTSOC Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	2260
SN74ABT16241ADGGR Texas Instruments	IC BUF NON-INVERT 5.5V 48TSSOP	4000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications