Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CY74FCT245ATSOC Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	770
SN74HCT245PW Texas Instruments	IC TXRX NON-INVERT 5.5V 20TSSOP	1902
SN74LVTH2245DGVR Texas Instruments	IC TXRX NON-INVERT 3.6V 20TVSOP	2717
SN74ALVC125DGVR Texas Instruments	IC BUF NON-INVERT 3.6V 14TVSOP	470
SN74AHC125DRG4 Texas Instruments	IC BUF NON-INVERT 5.5V 14SOIC	0
74ACT16863DL Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	1955
SN74F534ADWR Texas Instruments	BUS DRIVER	2000
SN74AHCT126QPWRQ1 Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	2487
SN74AUP2G34DCKR Texas Instruments	IC BUF NON-INVERT 3.6V SC70-6	3021
CD74FCT841AM Texas Instruments	BUS DRIVER, FCT SERIES	124
SN74LVT245BPW Texas Instruments	IC TXRX NON-INVERT 3.6V 20TSSOP	705
SN74LV125ATNS Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SOP	11150
SN74LVT162244ADL Texas Instruments	IC BUF NON-INVERT 3.6V 48SSOP	268
SN74ALS621AN Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	35
SN74ALVC244IPWREP Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	950
CD74AC646M96 Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	22000
5962-8872701RA Texas Instruments	SN54ALS640B OCTAL BUS TRANSCEIVE	75
SN74ALVC125NSRE4 Texas Instruments	IC BUFFER NON-INVERT 3.6V 14SOP	0
SN74LVT646DW Texas Instruments	REGISTERED BUS TRANSCEIVER	10850
SN74ABT2240ADW Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	700

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications