Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ABT245BDBR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	279
5962-8681201EA Texas Instruments	SN54HC368 HEX INVERTING BUS DRIV	370
SN74AS641DW Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	4661
SN74HC126PWT Texas Instruments	IC BUFFER NON-INVERT 6V 14TSSOP	3349
SN74AUC1G17DBVRG4 Texas Instruments	IC BUF NON-INVERT 2.7V SOT23-5	5162
SN75452BP Texas Instruments	IC PERIPHERAL DRIVER 5.25V 8DIP	1440
SN74AHC1G125DRLR Texas Instruments	IC BUFFER NON-INVERT 5.5V SOT5	11221
SN74AVC4T245PWG4 Texas Instruments	IC TRANSLATION TXRX 3.6V 16TSSOP	520
SN74BCT544NT Texas Instruments	REGISTERED BUS TRANSCEIVER	1680
74FCT16245TPVCG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	700
SN74AHC1G126DCKR Texas Instruments	IC BUF NON-INVERT 5.5V SC70-5	10496
SN74ALS1035N Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	383
CD54ACT540F3A Texas Instruments	CD54ACT540 INVERTING OCTAL BUFFE	6
SN74LVC2244APWR Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	23039
SN74LVCZ244APWR Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	6006
SN74LVCH16646ADLR Texas Instruments	IC TXRX NON-INVERT 3.6V 56SSOP	1000
SN74ALS641ADWR Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	1630
74ACT16245DGGR Texas Instruments	IC TXRX NON-INVERT 5.5V 48TSSOP	201710000
SN74F2245DWR Texas Instruments	BUS TRANSCEIVER	21000
SN74F2244DBR Texas Instruments	BUS DRIVER	2000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications